TCL先进半导体显示产业总部项目结构设计  

Structural design of TCL Advanced Semiconductor Display Industry Headquarters project

作　　者：黄卓 宋徽 黄旭丰 农少校 何助节 王传甲 HUANG Zhuo;SONG Hui;HUANG Xufeng;NONG Shaoxiao;HE Zhujie;WANG Chuanjia(A+E Design International Co.,Ltd.,Shenzhen 518031,China)

机构地区：[1]奥意建筑工程设计有限公司,深圳518031

出　　处：《建筑结构》2024年第21期30-37,共8页Building Structure

摘　　要：TCL先进半导体显示产业总部采用钢管混凝土柱+底部拱结构框架(钢梁)+钢筋混凝土核心筒结构体系,底部拱结构由上拱、下拱和拉梁组成,其中4个面的上拱转换15根外框柱,下拱仅承担2~4层楼面荷载,位于地下室顶板的拉梁来平衡拱结构水平推力,核心筒为双筒布置。通过对比拱桁架和单拱转换结构形式的受力特点,并综合考虑建筑效果、结构造价及施工可行性等因素,论述了本项目采用单拱转换结构形式的依据。结合项目的结构特点,制定相应的性能化设计目标,进行了小震、中震、大震的性能化验算,对大跨度楼盖进行舒适度验算,给出主要的钢结构节点做法。分析结果表明,本工程结构设计合理,整体性能满足设定的性能目标。The TCL Advanced Semiconductor Display Industry Headquarters project adopts the concrete⁃filled steel tubular column+bottom arch structure frame(steel beam)+reinforced concrete core tube structure system.The bottom arch structure is composed of upper arch,lower arch and tension beam.The upper arch of the four sides is converted into 15 outer frame columns.The lower arch only bears the load of 2~4 floors.The tension beam located on the basement roof balances the horizontal thrust of the arch structure,and the core tube is arranged in double tubes.By comparing the stress characteristics of arch truss and single arch conversion structure form,and considering the factors such as building effect,structural cost and construction feasibility,the basis of adopting single arch conversion structure form in this project was discussed.Combined with the structural characteristics of the project,the corresponding performance⁃based design objectives were formulated,and the performance test calculation of small,medium and large earthquakes were carried out.The comfort of large⁃span floors was checked,and the main steel structure joints were given.The analysis results show that the structural design of this project is reasonable,and the overall performance meets the set performance goals.

关 键 词：框架⁃核心筒混合结构 钢管混凝土 单拱转换 抗震性能设计 楼盖舒适度 钢结构节点 

分 类 号：TU398.9[建筑科学—结构工程]