CNT的表面改性对Cu基复合材料力学和电学性能的影响  

Effects of surface modification of CNT on the mechanical and electrical properties of Cu-based composites

作　　者：李一坤 张一凡 赵文敏 刘柏雄[1] 张雪辉[1] 曾龙飞[1] LI Yikun;ZHANG Yifan;ZHAO Wenmin;LIU Baixiong;ZHANG Xuehui;ZENG Longfei(Faculty of Materials Metallurgy and Chemistry,Jiangxi University of Science and Technology,Ganzhou 341000,China;Yunnan Key Laboratory of New Materials Prepartion and Processing,Kunming 650093,China;Dongguan EONTEC Co.,Ltd.,Dongguan 523662,China)

机构地区：[1]江西理工大学材料冶金化学学部,赣州341000 [2]云南省新材料制备与加工重点实验室,昆明650093 [3]东莞宜安科技股份有限公司,东莞523662

出　　处：《粉末冶金材料科学与工程》2024年第5期396-402,共7页Materials Science and Engineering of Powder Metallurgy

基　　金：国家自然科学基金资助项目(52304382);江西省重大科技基金资助项目(20223AAG01009);江西省教育厅青年基金资助项目(GJJ2200878);云南省新材料制备与加工重点实验室创新课题资助项目(2024KF08)。

摘　　要：提高碳纳米管(carbon nanotube,CNT)在Cu基体中的分散性以及两者的界面结合,可以有效改善碳纳米管增强Cu基(CNT/Cu)复合材料的性能。本文采用一步水热法在CNT表面原位生成碳化聚合物点(carbonized polymer dot,CPD),对CNT进行表面改性处理,再通过烧结法制备CNT@CPD/Cu复合材料,对复合材料的力学和电学性能进行测试。结果表明:经酸化处理的CNT1表面改性处理后,其结构破坏严重,增强效果减弱。未经酸化处理的CNT2表面改性处理后,CPD负载于CNT2上,不仅保留了CNT的结构完整性,还能显著改善其在基体中的分散性,增强与Cu的结合。此外,CPD和CNT的加入可有效细化Cu晶体,抑制位错运动;CPD和CNT与Cu基体间的“铆钉”界面结合,不仅能降低电子散射效应,还能为电子转移提供额外的通道,从而提升复合材料的电学性能。CNT2@CPD/Cu复合材料的极限抗拉强度相较纯Cu提高了28.9%,电导率为95.9%IACS。该研究结果为开发新型高强高导Cu基复合材料提供了新思路。Improving the dispersion of carbon nanotubes(CNT)in the Cu matrix and their interfacial bonding can effectively improve the properties of carbon nanotube enhanced Cu-based(CNT/Cu)composite material.This paper employed a one-step hydrothermal method to in situ generate carbonized polymer dots(CPD)on the surface of CNT for surface modification.Subsequently,CNT@CPD/Cu composites were prepared through a sintering process,and the mechanical and electrical properties of the composites were tested.The results indicate that after surface modification treatment,the structure of acid-treated CNT1 is severely damaged,leading to a weakened enhancement effect.In contrast,after surface modification of non-acid-treated CNT2,CPD is loaded onto CNT2,which not only preserves the structural integrity of the CNT but also significantly improves their dispersion in the matrix and enhances the bonding with Cu.Furthermore,the addition of CPD and CNT effectively refines the Cu crystals and suppresses dislocation movement.Additionally,the“rivet”interfacial bonding between CPD,CNTs,and the Cu matrix not only reduces electron scattering effects but also provides additional pathways for electron transfer,thereby enhancing the electrical property of the composites.The ultimate tensile strength of the CNT2@CPD/Cu composite increased by 28.9%compared to pure Cu,with a conductivity of 95.9%IACS.The findings of this study provide new insights for the development of novel high-strength and high-conductivity Cu-based composites.

关 键 词：CU基复合材料 碳化聚合物点 碳纳米管 力学性能 电学性能 

分 类 号：TB333[一般工业技术—材料科学与工程]