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作 者:郑敏华 Zheng Minhua(Zhuhai Dafushan Development Co.,Ltd.,Zhuhai Guangdong 519000,China)
机构地区:[1]珠海大富山发展有限公司,广东珠海519000
出 处:《山西化工》2024年第10期244-245,255,共3页Shanxi Chemical Industry
摘 要:硅酸盐分子筛是一种具有吸附脱附、催化、离子交换等多用途材料。本文对硅酸盐分子筛处理电镀含铜废水进行研究,分析了硅酸盐分子筛加量、吸附时间、温度和p H四个因素对Cu离子去除率的影响。通过实验分析得出最佳处理条件:在电镀废水质量浓度为98.2 mg/L时,硅酸盐分子筛加量为4 g/100 m L,合理的吸附时间为30 min,温度的影响不显著,可以选择室温25℃作为处理温度,适宜的酸碱环境是p H为4~5,合理的搅拌速度为90 r/min。本文研究为实际电镀废水处理过程提供了理论依据。Silicate molecular sieves are a kind of multi-purpose materials with adsorption,desorption,catalysis and ion exchange.In this paper,the effect of silicate molecular sieve dosage,adsorption time,temperature and pH on the removal rate of Cu ions was analyzed.Through the experimental analysis,the optimal treatment conditions were obtained:when the concentration of electroplating wastewater was 98.2 mg/L,the addition of silicate molecular sieve was 4 g/100 ml,the reasonable adsorption time was 30 min,and the effect of temperature was not significant.Room temperature 25℃could be selected as the treatment temperature,and the appropriate acid-base environment was pH 4~5,the reasonable mixing speed is 90 r/min.This study provides a theoretical basis for the actual electroplating wastewater treatment process.
分 类 号:X773[环境科学与工程—环境工程] X703
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