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作 者:Xu YANG Jinchai LI Xuhui PENG Chunfeng ZHAO Chao CHEN Xiaowei ZHANG Jinliang LIN Donghua LI Yuefen CHEN Zhaoxia BI Feng QIN Cheng LI Kai HUANG Junyong KANG Rong ZHANG
机构地区:[1]Fujian Key Laboratory of Semiconductor Materials and Applications,CI Center for OSED,Engineering Research Center of Micro-nano Optoelectronic Materials and Devices,Ministry of Education,Department of Physics,Xiamen University,Xiamen 361005,China [2]Future Display Institute of Xiamen,Xiamen 361005,China [3]Tianma Microelectronics Co.,Ltd.,Shenzhen 518000,China [4]School of Electronic Science and Engineering,Xiamen University,Xiamen 361005,China [5]Tianma Advanced Display Technology Institute(Xiamen)Co.,Ltd.,Xiamen 361100,China
出 处:《Science China(Information Sciences)》2024年第11期1-15,共15页中国科学(信息科学)(英文版)
基 金:supported in part by National Key Research and Development Program(Grant No.2022YFF0609504);National Natural Science Foundation of China(Grant Nos.62174141,61874090);Key Scientific and Technological Program of Xiamen(Grant No.3502Z20231048);Natural Science Foundation of Fujian Province of China(Grant No.2021J01008)。
摘 要:MicroLED display is considered one of the most promising technologies for next-generation displays.However,the high manufacturing cost has been a major obstacle to its accessibility to the general consumer market,and mass transfer,an essential process to achieve cost-effective manufacturing,has not yet reached commercial maturity.Critical issues,such as microLED chips,transfer equipments,and process materials,need to be addressed for the mass transfer technologies.In this work,we present a 1.63-inch full color microLED display module fabricated with laser mass transfer,which has a pixel density of 403 pixels per inch(PPI),the highest resolution ever achieved in the industry using mass transfer technologies.The laser mass transfer is realized with three process nodes:laser lift-off,laser induced forward transfer,and carrier bonding.Each node has been well explored to improve yields.Insights into the present progress and the future development of the laser mass transfer will be shared in this work.
关 键 词:microLED mass transfer LLO chip on wafer chip on carrier
分 类 号:TN873[电子电信—信息与通信工程]
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