芯片制造高温SPM清洗技术流场分析  

Flow Field Analysis of High Temperature SPM Cleaning Technology for Chip Manufacturing

作　　者：李俊 雷光宇 LI Jun;LEI Guangyu(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工艺技术》2024年第6期15-18,共4页Electronics Process Technology

摘　　要：随着集成电路技术的不断发展,对芯片清洗工艺的要求也越来越高。高温SPM清洗技术作为一种先进的湿法清洗工艺,在芯片制造中发挥着重要作用。首先介绍了芯片制造中的湿法工艺,重点阐述了高温SPM清洗技术的原理和应用,分析了影响工艺性能的因素,并对高温SPM清洗的流场进行了建模与仿真分析,为高温SPM清洗设备的优化设计提供了理论依据。With the continuous development of integrated circuit technology,the requirement of chip cleaning process is getting higher and higher.As an advanced wet cleaning technology,high temperature SPM cleaning technology plays an important role in chip manufacturing.Firstly,the wet process in chip manufacturing is introduced,the principle and application of high temperature SPM cleaning technology are emphasized,the factors that affect the process performance are analyzed,the flow field of high temperature SPM cleaning is modeled and simulated,which provides a theoretical basis for the optimization design of high temperature SPM cleaning equipment.

关 键 词：集成电路 湿法工艺 SPM清洗 流场 

分 类 号：TN405[电子电信—微电子学与固体电子学]