Ka波段LTCC一体化集成基板的关键技术  

Key Technologies of Ka-band LTCC Integrated Substrate

作　　者：梁杰 王颖麟 LIANG Jie;WANG Yinglin(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2024年第6期26-29,共4页Electronics Process Technology

摘　　要：Ka波段LTCC一体化集成基板由于工作频率高,对LTCC基板加工工艺和加工精度提出了更高的要求。通过对LTCC基板制造关键工艺的分析、改进和优化,实现了高精度高可靠的LTCC基板制造。通过Ka波段LTCC基板研发工艺和测试平台的建设,部分关键指标有所提高,满足了毫米波段产品的批量生产对产品一致性和可靠性的较高需求。The Ka-band LTCC integrated substrate has higher requirements for LTCC substrate processing technology and processing precision due to its high operating frequency.By analyzing,improving,and optimizing the key processes of LTCC substrate manufacturing,high-precision and high-reliability LTCC substrate manufacturing has been achieved.Through the development of Ka-band LTCC substrate technology and the construction of testing platforms,some key indicators have been improved,meeting the high demand for product consistency and reliability in the mass production of millimeter wave products.

关 键 词：毫米波 LTCC工艺 加工精度 可靠性 

分 类 号：TN605[电子电信—电路与系统]