可调控封装技术在功率器件封装中的应用  

Application of Adjustable Packaging Technology in Power Device Packaging

作　　者：何东 敬小东[1] 崔西会[1] 董飞 张人天 方杰 罗文锴 HE Dong;JING Xiaodong;CUI Xihui;DONG Fei;ZHANG Rentian;FANG Jie;LUO Wenkai(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《电子工艺技术》2024年第6期57-59,共3页Electronics Process Technology

摘　　要：随着功率电子器件的发展,单一的封装材料已经难以满足当前高密度集成功率器件封装所需的综合性能需求。研究了一种新型封装技术,即可调控封装技术,开展了封装壳体设计、制造和优化工作,并进行了散热性能测试。结果表明,可调控封装技术可有效解决功率器件散热问题,并对不同散热需求的器件提供个性化解决方案。With the rapid development of power device,it is difficult for a single packaging material to meet the comprehensive performance requirements of high density integrated packaging of the power components.A new packaging technology,namely controllable packaging technology,is studied.The design,manufacturing,and optimization of packaging shells are carried out,and the heat dissipation performance is tested.The results show that adjustable packaging technology can effectively solve the heat dissipation problem of power devices and provide personalized solutions for devices with different heat dissipation requirements.

关 键 词：可调控封装 功率器件 散热 

分 类 号：TN605[电子电信—电路与系统]