基于PLC的气流辅助热压印设备自动控制系统设计  

Design of Automatic Control System for Air-assisted Hot Embossing Equipment Based on PLC

作　　者：胡满凤 石凯 杜嘉达 Hu Manfeng;Shi Kai;Du Jiada(School of Electrical Engineering,Guangzhou Railway Polytechnic,Guangzhou 511300,China;School of Mechanical and Electrical Engineering,Guangdong Polytechnic of Industry and Commerce,Guangzhou 510550,China;Foshan Sanshui Yingjie Precision Machinery Co.,Ltd.,Foshan,Guangdong 528133,China)

机构地区：[1]广州铁路职业技术学院电气工程学院,广州511300 [2]广东工贸职业技术学院机电工程学院,广州510550 [3]佛山市三水盈捷精密机械有限公司,广东佛山528133

出　　处：《机电工程技术》2024年第10期41-46,共6页Mechanical & Electrical Engineering Technology

基　　金：广东省基础与应用基础研究基金项目(2020A1515111200);广州铁路职业技术学院教科研培育项目重点项目(GTXYZ2201);广东工贸职业技术学院2024年校级科研项目(竞争性项目)(2024-ZK-08)。

摘　　要：微流控芯片、微透镜阵列等高附加值产品批量化生产依赖热压印设备,但传统热压印设备加热效率及控制精度较低,较难满足快速精密生产需求。提出采用气流和加热棒一起加热的方法提高加热效率,并基于PID级联控制原理设计气流辅助热压印设备的自动化控制系统。首先,采用SolidWorks建立气流辅助热压印设备三维模型;然后,采用TIA portal软件设计自动控制系统;最后,创建WinCC组态监控工程,搭建实物设备,研究气流辅助热压印设备及自动控制系统性能。实验结果表明:采用气、固双热源加热方法的加热效率比单一热源提高50%~70%;利用PID级联控制方式调控温度参数的响应速度快,抗干扰能力强;通过组态系统可以实时监控热压温度、热压压力、保压时间等工艺参数;在68 s内实现了微透镜阵列产品快速精密微成型。The mass production of high value-added products such as microfluidic chips and microlens arrays relies on hot embossing equipment,but the heating efficiency and control accuracy of traditional hot-embossing equipment are low,which is difficult to meet the needs of rapid and precise production.Therefore,a method of using airflow and heating rod to heat together is proposed to improve heating efficiency,and an automatic control system of airflow-assisted hot embossing equipment is designed based on the principle of PID cascade control.First,a 3D model of airflow-assisted hot embossing equipment is established by using SolidWorks.Then,the TIA portal software is used to design the automatic control system.Finally,the WinCC configuration monitoring project is created,the physical equipment is built,and the performance of airflow-assisted hot embossing equipment and automatic control system is studied.The experimental results show that the heating efficiency of the gas-solid dual heat source heating method is 50%~70%higher than that of the single one.Temperature PID cascade control method has fast response speed and strong anti-interference ability;process parameters such as hot embossing temperature,hot embossing force,holding time can be monitored in real time through the configuration system;and the rapid and precise microforming of microlens arrays is achieved within 68 s.

关 键 词：西门子PLC 热压印 PID级联控制 自动化控制系统 

分 类 号：TP27[自动化与计算机技术—检测技术与自动化装置]