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作 者:张志国 周航 李淑君[2] ZHANG Zhiguo;ZHOU Hang;LI Shujun(Beijing Century Weifang Biotechnology Co.,Ltd.,Beijing 100085,China;College of Materials Science and Engineering,Northeast Forestry University,Harbin 150040,China)
机构地区:[1]北京世纪伟方生物技术有限公司,北京100085 [2]东北林业大学材料科学与工程学院,哈尔滨150040
出 处:《森林工程》2024年第6期159-165,共7页Forest Engineering
基 金:国家木竹产业技术创新战略联盟项目(TIAWBI 2022-08)。
摘 要:为开发刨花板用无醛胶黏剂、满足广阔的市场需求,针对传统淀粉胶黏剂存在固含量低、黏度高和耐水胶接性能差等应用问题,采用新型无醛淀粉胶黏剂(DSA)制备刨花板,探讨其热压工艺、施胶量以及DSA和异氰酸酯(pMDI)胶黏剂复合使用对制造刨花板性能的影响。结果表明,以DSA制得刨花板的性能略低于以pMDI制得刨花板的性能,但DSA与pMDI复合使用时表现出节胶增效的协同作用,而且使用DSA可替代约20%的pMDI胶黏剂,同时热压因子可降低13.3%,有助于提升E_(NF)级刨花板的生产效率。DSA胶黏剂单独使用或与pMDI联用时,能够有效发挥黏结、填充、扩链、固化的作用,有助于解决传统淀粉胶黏剂工艺性能不佳、耐水胶接性能差等关键问题,有利于推动生物质绿色胶黏剂在人造板中的规模化应用。In order to develop formaldehyde-free adhesive for particleboard and meet the broad market demand,this paper fo⁃cused on the application problems of traditional starch adhesive,such as low solid content,high viscosity,poor water resistance and so on,and a novel formaldehyde-free starch adhesive DSA was used to prepare particleboard.The effects of hot pressing curves,dos⁃age of adhesive,and the combined application of DSA and pMDI on the properties of particleboard were investigated.The results showed that the performance of the novel formaldehyde-free starch adhesive DSA was slightly inferior to that of pMDI,but the com⁃bined use of DSA and pMDI exhibited a synergistic effect of saving adhesive and enhancing efficiency.Furthermore,the use of DSA could replace approximately 20%of isocyanate adhesive,meanwhile the hot pressing factor was reduced by 13.3%,which was benefi⁃cial for improving the production efficiency of E_(NF)grade particleboard.When DSA adhesive was used alone or in combination with pMDI,it could effectively play the role of bonding,filling,chain extension and curing.The application of DSA could help to solve the key problems of poor technological performance and poor water-resistant bonding performance of traditional starch adhesive,and pro⁃mote the large-scale application of biomass green adhesive in wood-based particle boards.
关 键 词:无醛淀粉胶黏剂 异氰酸酯 复配 刨花板 热压工艺
分 类 号:S781.65[农业科学—木材科学与技术]
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