电机驱动器塑封工艺研究  

Research on Plastic Sealing Process of Motor Drive Device

作　　者：王建成 WANG Jiancheng(Lianyungang JARI Electronics Co.,Ltd.,Lianyungang 222000,China)

机构地区：[1]连云港杰瑞电子有限公司,江苏连云港222000

出　　处：《新技术新工艺》2024年第10期14-23,共10页New Technology & New Process

摘　　要：随着电子封装产品朝小型化、低成本、高性能和高可靠性方向发展,使用塑封技术将塑封料、芯片、元器件和PCB印制板等封装成同一封装体的系统级封装技术成为新的发展方向。结合驱动器产品小型化、低成本和高可靠性的需求及系统级封装的关键技术,重点介绍了驱动器塑封工艺设计、塑封料选择、PCB高温焊料选择和塑封驱动器散热结构设计。运用模流仿真和翘曲仿真分析手段,得出封装过程模流充填情况、气穴分布情况和塑封后产品最大应变位置,提前预判了塑封过程的薄弱环节,为塑封产品的结构设计和塑封模具设计提供指导。最后用实际样品进行了温度循环试验、超声扫描试验和一系列电性能测试验证,结果表明,选择的塑封料和驱动器塑封工艺设计满足产品需求。With the development of electronic packaging products towards miniaturization,low cost,high performance and high reliability,the system level packaging technology that used plastic encapsulation technology to encapsulate plastic encapsulation materials,chips,components and PCB printed boards into the same package has been becoming a new devel-opment direction.Based on the requirements of miniaturization,low cost and high reliability of servo drivers and the key technologies of system-level packaging,focused on the design of plastic sealing process,selection of plastic sealing materi-als,selection of PCB high temperature solder and design of heat dissipation structure of plastic sealing drivers.By means of mold flow simulation and warp simulation analysis,the mold flow filling,cavitation distribution and the maximum strain position of the product after plastic sealing were obtained,and the weak link in the plastic sealing process was predicted in advance,which provided guidance for the structural design of the plastic sealing product and the design of the plastic sealing mold.Finally,the temperature cycle test,ultrasonic scanning test and a series of electrical properties test were carried out with the actual samples.The results showed that the selected plastic sealing material and the plastic sealing process design of the driver met the requirements of the product.

关 键 词：驱动器 塑封 PCB 模流仿真 工艺研究 力学仿真 

分 类 号：TJ05[兵器科学与技术—兵器发射理论与技术] TN405[电子电信—微电子学与固体电子学] TH162[机械工程—机械制造及自动化] TP391.9[自动化与计算机技术—计算机应用技术]