Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical,Thermal and Dielectric Properties of Low-k Polyimide  

作　　者：Wan-Jing Zhao Yi-Zhang Tong Pei-Pei Zeng Yang-Sheng Zhou Xian-Wu Cao Wei Wu 

机构地区：[1]National Engineering Research Center of Novel Equipment for Polymer Processing,Key Laboratory of Polymer Processing Engineering of Ministry of Education,Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing,School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou,510640,China [2]Engineering Center for Superlubricity,Jihua Laboratory,Foshan,528200,China [3]Guangdong Provincial Key Laboratory of Distributed Energy Systems,Guangdong Provincial Engineering Research Center of Distributed Energy Systems,Dongguan University of Technology,Dongguan,523808,China

出　　处：《Chinese Journal of Polymer Science》2024年第11期1824-1834,I0014,共12页高分子科学（英文版）

基　　金：financially supported by the National Natural Science Foundation of China(No.52103029)。

摘　　要：Polyimide(PI)is widely used in high-frequency communication technology due to its exceptional comprehensive properties.However,traditional PI has a relatively elevated dielectric constant and dielectric loss.Herein,the different cross-linked structures were introduced in PI matrix and conducted a detailed discussion on the influence of cross-linking agent content and cross-linking structure type on the overall performance of PI films.In comparison to the dielectric constant of 2.9 of neat PI,PI with an interchain cross-linking structure containing 2 wt%1,3,5-tris(4-aminophenyl)benzene(TAPB)(interchain-PI-2)exhibited the reduced dielectric constant of 2.55 at 1 MHz.The PI films with intrachain crosslinking structure containing 2 wt%TAPB(intrachain-PI-2)exhibited the lowest dielectric constant of 2.35 and the minimum dielectric loss of0.0075 at 1 MHz.It was due to the more entanglement junctions of intrachain-PI resulting in decreased carrier transport.The thermal expansion coefficients of both interchain-PI and intrachain-PI films were effectively reduced.Moreover,in contrast to interchain-PI films,the intrachain-PI films maintained colorlessness and transparency as the cross-linking agent content increased.This work compared the effects of two different cross-linked structures on the performance of PI films and provided a feasible way to obtain low-k PI films with excellent comprehensive performance for 5G applications.

关 键 词：Interchain cross-linking Intrachain cross-linking POLYIMIDE Low dielectric 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]