A review of extreme condition effects on solder joint reliability:Understanding failure mechanisms  

作　　者：Norliza Ismail Wan Yusmawati Wan Yusoff Azuraida Amat Nor Azlian Abdul Manaf Nurazlin Ahmad 

机构地区：[1]Department of Physics,Centre for Defence Foundation Studies,Universiti Pertahanan Nasional Malaysia,Kem Sungai Besi,Kuala Lumpur,57000,Malaysia [2]Centre for Tropicalization(CENTROP),Defence Research Institute,Universiti Pertahanan Nasional Malaysia,Kem Sungai Besi,Kuala Lumpur,57000,Malaysia

出　　处：《Defence Technology（防务技术）》2024年第11期134-158,共25页Defence Technology

基　　金：fully supported by a Tabung Amanah Pusat Pengurusan Penyelidikan&Inovasi(PPPI)(Grant No.PS060-UPNM/2023/GPPP/SG/1);Universiti Pertahanan Nasional Malaysia(UPNM)for funding this study。

摘　　要：Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.

关 键 词：Solder joint Extreme condition Failure mechanism Defence and military RELIABILITY 

分 类 号：TG40[金属学及工艺—焊接] TB114.3[理学—概率论与数理统计]