基于CBDC优化超声辅助水下激光切割单晶硅的工艺  

Optimization of ultrasonic-assisted underwater laser cutting monocrystalline silicon process based on CBDC

作　　者：周嘉[1,2] 周辽 欧阳励 焦辉 黄宇星 龙芋宏 ZHOU Jia;ZHOU Liao;OUYANG Li;JIAO Hui;HUANG Yuxing;LONG Yuhong(Guangxi Key Laboratory of Manufacturing Systems and Advanced Manufacturing Technology,School of Mechanical&Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China;School of Electronic Engineering and Automation,Guilin University of Electronic Technology,Guilin 541004,China)

机构地区：[1]桂林电子科技大学机电工程学院、广西制造系统与先进制造技术重点实验室,桂林541004 [2]桂林电子科技大学电子工程与自动化学院,桂林541004

出　　处：《激光技术》2024年第6期913-921,共9页Laser Technology

基　　金：国家自然科学基金资助项目(62274045,62364008,52165056);中国博士后科学基金资助项目(2023MD734164);广西科技基地和人才专项基金资助项目(2021AC18026);广西研究生教育创新计划资助项目(YCSW2022287,YCBZ2022114);广西中青年科研基础能力提升项目(2022KY0178,2022KY0201);广西制造系统与先进制造技术重点实验室主任基金资助项目(22-35-4-S014)。

摘　　要：为了对超声辅助水下纳秒激光切割工艺进行快速的优化,通过分析空化气泡动力学特性(CBDC)对工艺效果的影响,采用数值仿真分析、正交试验和高速摄像方法进行了理论分析和实验验证,得到了超声辅助水下激光切割工艺的优化参数,并验证了CBDC是影响切割工艺的主要因素。结果表明,随着空化气泡对激光束的干扰程度增加,切槽深度降低速度增加;随着切槽深宽比的增加,空化气泡脉动冲击对切槽底部产生的等效应力越大;当超声功率P u=65 W、水层厚度h w=1 mm、激光脉冲频率f q=20 kHz、激光扫描速率v=1 mm/s时,可以获得最大深宽比约为1.71,槽宽约为99.88μm,槽深约为170.18μm,热影响区大小约为31.71μm,微裂纹长度约为33.42μm,此时空化气泡周期较短(约为100μs~160μs)。该研究可为多能场水下激光复合加工工艺参数的优化提供参考。In order to rapidly optimize the ultrasonic-assisted underwater nanosecond laser cutting process,the impact of cavitation bubble dynamics characteristics(CBDC)on the process outcomes was analyzed.And theoretical analysis and experimental validation were carried out using numerical simulation analysis,orthogonal experiments,and high-speed imaging methods.Optimal parameters for the ultrasonic-assisted underwater laser cutting process were obtained,and the CBDC was confirmed to be the primary factor affecting the cutting process.The results showe that as the interference of cavitation bubbles with the laser beam increases,the cutting depth decreases while the cutting speed increases.As the depth-to-width ratio of the groove increases,the pulsating shock from cavitation bubbles exerte greater equivalent stress on the groove bottom.The maximum depth-to-width ratio of approximately is 1.71 achieved when ultrasonic power P u=65 W,water layer thickness h w=1 mm,laser pulse frequency f q=20 kHz,and laser scanning speed v=1 mm/s,respectively.Under these conditions,the groove width is approximately 99.88μm,the groove depth is approximately 170.18μm,the size of the heat-affected zone is approximately 31.71μm,and the microcrack length is approximately 33.42μm.At this time,the cavitation bubble cycle is shorter(approximately 100μs~160μs).This research can provide valuable insights for optimizing the parameters of multi-field underwater laser composite processing.

关 键 词：激光技术 超声辅助 水下激光切割 空化气泡 工艺优化 

分 类 号：TN249[电子电信—物理电子学] TH162[机械工程—机械制造及自动化]