Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high-voltage power module packaging  

作　　者：Zhengdong Wang Ganqiu Yang Xiaolong Cao Mengli Li Tong Zhang Chenxin Liu Yuanhang Zhou Yonghong Cheng 

机构地区：[1]School of Mechanical and Electrical Engineering,Xi'an University of Architecture and Technology,Xi'an,China [2]State Key Laboratory of Electrical Insulation and Power Equipment,Xi'an Jiaotong University,Xi'an,China

出　　处：《High Voltage》2024年第5期1021-1032,共12页高电压（英文）

基　　金：National Natural Science Foundation of China,Grant/Award Number:52307028;The State Key Laboratory of Electrical Insulation and Power Equipment Open Project,Grant/Award Number:EIPE22210;Shaanxi Provincial Science and Technology Department Youth Foundation,Grant/Award Number:2022JQ-300;Shaanxi Province Industry-University-Research Collaborative Innovation Plan,Grant/Award Number:2023YFBT-45-02。

摘　　要：Internal insulation of high-voltage power modules is facing interesting failure risks,including high temperature overheating,breakdown fault,material cracking etc.,so it is imperative to urgently develop new dielectric materials with high thermal conductivity(λ),outstanding electrical insulation,and thermal stability properties.A method to construct controllable liquid crystalline cross-linking networks based on the synthesis of biphenyl epoxy monomer and the change of curing agent structures and curing temperature is proposed.The uniform nematic rod-like liquid crystalline domains were obtained by using 4,4-diaminodiphenylmethane as a curing agent under a pre-curing temperature of 105°C.The resulting film(abbreviated as TD-105)exhibitedλup to 0.53 W m^(-1) K^(-1) and a dielectric breakdown strength of 57.69 kV mm^(-1),which showed a simultaneous enhancement of 178%and 16%,respectively,compared to traditional bisphenol A epoxy resin.Moreover,it also exhibited lower dielectric loss and magnitude of partial discharge while having higher glass-transition temperature(190°C).A novel idea for the development of high-performance epoxy insulating materials for the application of high-voltage and large-power electrical equipment is provided.

关 键 词：THERMAL DIELECTRIC CURING 

分 类 号：TM216[一般工业技术—材料科学与工程]