High-performance thermal interface materials enabled by vertical alignment of lightweight and soft graphene foams  

作　　者：Huaqiang Fu Renqiang Fang Chao Tian Wei Qian Shiya Cao Ziran Zhang Xiaoxi Xu Chuang Yao Zhe Wang Daping He 

机构地区：[1]School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, 430070, China [2]Hubei Engineering Research Center of RF-Microwave Technology and Application, School of Science, Wuhan University of Technology, Wuhan, 430070, China [3]School of Materials and Microelectronics, Wuhan University of Technology, Wuhan, 430070, China [4]Shanghai Institute of Satellite Engineering, Shanghai, 201109, China [5]State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, China

出　　处：《Nano Research》2024年第11期9293-9299,共7页纳米研究（英文版）

基　　金：financial support from the National Natural Science Foundation of China(No.22279097);the Key R&D Program of Hubei Province(No.2023BAB103);the Foundation of National Key Laboratory of Microwave Imaging Technology,the China Postdoctoral Science Foundation(No.2023M732723);the Fundamental Research Funds for the Central Universities(No.WUT: 2022IVA172).

摘　　要：High-performance thermal interface materials (TIMs) are highly sought after for modern electronics. Two-dimensional (2D) materials as vertical aligned fillers can optimize the out-plane thermal conductivity (k ⊥), but their excessively high content or intrinsic rigidness deteriorate TIMs softness, leading to worsening for thermal contact resistance (R contact). In this study, 2D graphene materials are fabricated into lightweight and soft graphene foams (GFs) with high-orientation, acting as vertical filler frameworks to optimize the k ⊥ and R contact for vertical GF (VGF) TIMs. The VGF-TIM has a high k ⊥ of 47.9 W·m^(−1)·K^(−1) at a low graphene content of 15.5 wt.%. Due to the softness and low filler contents of GFs, the VGF-TIM exhibits a low compressive module (4.2 MPa), demonstrating excellent compressibility. The resulting TIM exhibit a low contact resistance of 24.4 K·mm2·W^(−1), demonstrating 185.1% higher cooling efficiency in practical heat dissipating scenario compared to commercial advanced TIMs. This work provides guidelines for the design of advanced TIMs and their applications in thermal management.

关 键 词：GRAPHENE foam thermal resistance thermal conductivity thermal interface materials 

分 类 号：TQ127.11[化学工程—无机化工]