声表面波器件在大功率作用下的热效应  

The thermal effect of surface acoustic wave devices under high power

作　　者：黄庆云 黄健 万志坚 陈知泰 韩建伟 HUANG Qingyun;HUANG Jian;WAN Zhijian;CHEN Zhitai;HAN Jianwei(Shenzhen Polytechnic University,Shenzhen 518055,China)

机构地区：[1]深圳职业技术大学,深圳518055

出　　处：《应用声学》2024年第6期1381-1388,共8页Journal of Applied Acoustics

基　　金：深圳职业技术大学青年创新基金项目(6023310020K)。

摘　　要：声表面波器件在高电场强度和高频驱动下易产生热量,这种热量会显著影响器件的寿命、耐用性和测量精度,甚至造成器件本身的裂片与失效等问题。目前只有少数的研究关注了器件热效应。该文在前人研究的基础上,旨在揭示器件热效应来源,建立了声表面波作用下器件发热效应的有限元分析模型,对器件本身的损耗机制进行了讨论,通过搭建实验平台和有限元仿真对比阐明器件的自热效应,并且分析封装对于器件表面热分布的影响,进一步阐述了大功率作用下器件失效的原因。该文可以为声表面波器件微流体驱动的产业化进程提供技术支撑。Surface acoustic wave(SAW)devices have a tendency to generate heat under conditions of strong electricfields and high-frequency driving,this heat will negatively impact the device’s life,durability,and measurement accuracy.It may even result in issues like cracks and failures of the device itself.Only a few research studies have focused on the device’s thermal effect.Based on earlier research,this work tries to identify the cause of the device’s thermal effect,develops a model for the device’s thermal development under the influence of SAW,and examines the system’s loss process.Through the construction of an experimental platform and the comparison offinite element simulation to elucidate the self-heating effect of the device,and the analysis of the effect of encapsulation on the surface heat distribution of the device,and further elaborate the reasons for the failure of the device under the action of high power,which can provide technical support for the industrialization of the microfluidic drive of the SAW device.

关 键 词：声表面波 有限元仿真 损耗 热效应 

分 类 号：TN384[电子电信—物理电子学]