超薄硅基VC的实验研究  

Experimental Study on an Ultra-thin Silicon-Based Vapor Chamber

作　　者：周东方 陈岩[1] 李加乾 辛公明[1] ZHOU Dongfang;CHEN Yan;LI Jiaqian;XIN Gongming(School of Energy and Power Engineering,Shandong University,Jinan 250061,China)

机构地区：[1]山东大学能源与动力工程学院,济南250061

出　　处：《工程热物理学报》2024年第11期3435-3439,共5页Journal of Engineering Thermophysics

基　　金：国家自然科学基金(No.U20A20300);山东省自然基金(No.ZR2023ME184)。

摘　　要：电子器件小型化和集成化导致芯片热流密度升高,并使在受限空间内的散热变得具有挑战性。硅基蒸汽腔(Vapor chamber,VC)提供了一种简单、可靠且易于集成的散热方案。本文设计并制作了一款尺寸为7 mm×7 mm×0.6 mm的超薄硅基VC,搭建了实验系统,探究了三种工质(2100A、无水乙醇、去离子水)对硅基VC传热性能的影响。实验结果表明,以无水乙醇为工质的硅基VC热阻最低,相较于未充液的VC热阻降低了61.4%,以去离子水为工质的硅基VC在高热负荷下表现出最优的均温性能。The miniaturization and integration of electronic devices have led to the increase of chips heat flux,making heat dissipation in confined spaces increasingly challenging.Silicon-based vapor chambers(VC)provide a simple,reliable,and easily integrable solution.An ultra-thin silicon-based VC with dimensions of 7 mm×7 mm×0.6 mm was designed and fabricated in this study.An experimental system was set up to investigate the impact of three working fluids(2100A,anhydrous ethanol,and deionized water)on the heat transfer performance of the silicon-based VC.Experimental results show that the silicon-based VC using anhydrous ethanol has the lowest thermal resistance,reducing thermal resistance by 61.4%compared to the unfilled VC.Additionally,the silicon-based VC using deionized water demonstrates the best temperature uniformity performance under high heat loads.

关 键 词：超薄硅基蒸汽腔 芯片散热 相变传热 

分 类 号：TK172[动力工程及工程热物理—热能工程]