Super-stealth dicing technology opens a new era for nanofabrication oftransparent solids  

超隐形激光切割技术开启透明固体纳米加工新时代

作　　者：Xixing Wen Sai-Wing Tsang Xiuwen Xu 文西兴;曾世荣;徐修文

机构地区：[1]College of Electronic and Optical Engineering and College of Flexible Electronics(Future Technology),Nanjing University of Posts and Telecommunications,Nanjing 210023,China [2]Department of Materials Science and Engineering,City University of Hong Kong,Hong Kong 999077,China

出　　处：《Science Bulletin》2024年第21期3314-3317,共4页科学通报（英文版）

基　　金：the support from the National Natural Science Foundation of China(62204129 and 62205154);the Natural Science Research Start-up Foundation of Recruiting Talents of Nanjing University of Posts and Telecommunications(NY221112 and NY222001).

摘　　要：Laser manufacturing, capable of dicing materials (e.g., semiconductor wafers, transparent dielectric, etc.) into components or evenchips with intricate designs and precise patterns, underpinstoday’s semiconductor and optoelectronic industries [1–3]. Despitethe success, current laser dicing technologies only afford a nearmicrometer kerf width at a depth-to-width ratio of about 102due to the wave nature of the light [4–7], which lags the developments of many high-tech fields such as nanophotonics [8] andmicroelectronics [9]. Importantly, this performance ceiling is notbecause of technological deficiencies but rooted in fundamentalphysical constraints. As dictated by the Fourier bandwidth theorem in diffractive optics, the transverse width and longitudinaldepth of the focal spot are inherently linked. Tight focusing to narrow the beam width leads to broadening of the divergence angle,limiting the longitudinal depth achievable. Consequently, achieving nanometric dicing width and high aspect ratios simultaneouslyusing a focused laser beam is physically impossible. Althoughapproaches such as Bessel-Gaussian beams [10], high-anglepseudo-Bessel beams [11], and nonlinear laser filaments causedby the Kerr effect [3] have been developed to manipulate and compress the light field, the underlying mechanism is still based ondiffraction optics, which, of course, cannot break the physicallimits.

关 键 词：TRANSPARENT OPTICS BESSEL 

分 类 号：TG485[金属学及工艺—焊接] TB383.1[一般工业技术—材料科学与工程]