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作 者:张翀 崔惠泽 郭瑞鲁 陈铄 李文鹏 ZHANG Chong;CUI Huize;GUO Ruilu;CHEN Shuo;LI Wenpeng(China Electric Power Research Institute,Beijing 102209,China)
机构地区:[1]中国电力科学研究院有限公司,北京102209
出 处:《绝缘材料》2024年第11期93-97,共5页Insulating Materials
基 金:国家电网公司科技项目(5500-202258105A-1-1-ZN)。
摘 要:采用氧化铝和硅微粉混合填料填充双酚A型环氧树脂体系,制备了高导热玻璃纤维缠绕增强环氧树脂复合材料。研究了填料用量对缠绕复合材料力学性能、电气性能和导热性能的影响。结果表明:混合填料的加入有利于提高复合材料的热稳定性和导热性。当填料质量分数为62%(其中硅微粉质量分数为48%,氧化铝质量分数为14%)时,缠绕复合材料的单向板拉伸强度(0°和90°方向)、单向板弯曲强度以及NOL环拉伸强度分别为160.25、24.50、245.40、134.30 MPa,介电常数为1.889,介质损耗因数为0.673×10^(-2),体积电阻率为3.36×10^(16)Ω·cm,热导率为1.257 W/(m·K),相比添加前的导热系数提高了155%。A glass fiber winding reinforced epoxy resin composite with high thermal conductivity was prepared by filling the bisphenol A type epoxy resin system with a mixture of alumina and silica powder fillers.The effects of filler content on the mechanical properties,electrical properties,and thermal conductivity of composite were studied.The results show that the addition of mixed fillers is beneficial for improving the thermal stability and thermal conductivity of the composite.When the mass fraction of the fillers is 62%(of which the mass fraction of silicon powder is 48%and the mass fraction of alumina is 14%),the tensile strength(0°and 90°directions),bending strength,and NOL ring tensile strength of the composite are 160.25,24.50,245.40,and 134.30 MPa,respectively.The dielectric constant is 1.889,the dielectric loss factor is 0.673×10-2,the volume resistivity is 3.36×1016Ω·cm,and the thermal conductivity is 1.257 W/(m·K),which is 155%higher than the thermal conductivity before addition.
分 类 号:TM215[一般工业技术—材料科学与工程]
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