PCB基板用高耐热双环戊二烯环氧树脂的合成及性能  

Synthesis and properties of high heat-resistant dicyclopentadiene epoxy resin for PCB substrates

作　　者：支肖琼 唐安斌[1,2] 李秀云[1] 黄杰[2] 庞婷[2] 廖曦 ZHI Xiaoqiong;TANG Anbin;LI Xiuyun;HUANG Jie;PANG Ting;LIAO Xi(School of Materials and Chemistry,Southwest University of Science and Technology,Mianyang 621000,China;National Insulating Material Engineering Research Center,Sichuan EM Technology Co.,Ltd.,Mianyang 621000,China)

机构地区：[1]西南科技大学材料与化学学院,四川绵阳621000 [2]四川东材科技集团股份有限公司国家绝缘材料工程技术研究中心,四川绵阳621000

出　　处：《绝缘材料》2024年第11期98-105,共8页Insulating Materials

摘　　要：本文以双环戊二烯、邻烯丙基苯酚、环氧氯丙烷为原料,合成了高耐热的邻烯丙基苯酚-双环戊二烯环氧树脂,采用红外光谱、凝胶色谱对其结构进行表征;分别采用双酚A酚醛树脂、苯并噁嗪树脂及活性酯对环氧树脂进行固化,压制了PCB基板,采用差示扫描量热及热失重分析对体系的固化行为进行研究,测试了板材的力学性能、介电性能及吸水性能,并将其与苯酚-双环戊二烯环氧树脂的固化体系进行了对比。结果表明:邻烯丙基苯酚-双环戊二烯环氧树脂较苯酚-双环戊二烯环氧树脂具有更高的耐热性(玻璃化转变温度Tg和5%热失重温度Td5%较高)、弯曲强度、冲击强度、高温弯曲强度保持率以及更优的介电性能和更低的吸水率。A high heat resistant o-allylphenol-dicyclopentadiene epoxy resin was synthesized using dicyclopentadiene,o-allylphenol,and epichlorohydrin as raw materials,and its structure was characterized by infrared spectrum and gel chromatography.Then the epoxy resin was cured with bisphenol-A phenolic resin,benzoxazine resin,and active ester respectively,and a PCB substrate was pressed.The curing behavior of the system was studied by differential scanning calorimetry and thermogravimetric analysis.The mechanical properties,dielectric properties,and water absorption properties of the PCB substrate were tested,and compared with the curing system of phenol-dicyclopentadiene epoxy resin.The results show that compared with phenol-dicyclopentadiene epoxy resin,the o-allylphenol-dicyclopentadiene epoxy resin has higher heat resistance(glass transition temperature Tg and 5%thermogravimetric temperature Td5%are higher),bending strength,impact strength,high temperature bending strength retention,and better dielectric properties,lower water absorption.

关 键 词：高耐热 邻烯丙基苯酚-双环戊二烯环氧树脂 力学性能 介电性能 吸水率 

分 类 号：TM215.1[一般工业技术—材料科学与工程]