Sn层厚度对Al_(2)O_(3)/Ni焊点的组织与力学性能影响  

Effects of Sn Layer Thickness on Microstructure and Properties of Al_(2)O_(3)/Ni Solder Joints

作　　者：刘振宇 刘生发[1] 王振[1] 刘俐 LIU Zhenyu;LIU Shengfa;WANG Zhen;LIU Li(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070)

机构地区：[1]武汉理工大学材料科学与工程学院,武汉430070

出　　处：《特种铸造及有色合金》2024年第11期1563-1568,共6页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(62004144,62274122)。

摘　　要：采用Al-Ni纳米多层膜作为自蔓延放热反应的热源,在室温下成功制备了Al_(2)O_(3)陶瓷/Ni自蔓延焊点。借助扫描电镜(SEM)、X射线能谱仪(EDS)以及X射线衍射仪(XRD)对焊点截面与断面的组织形貌、元素分布及物相组成进行了表征,系统研究了Sn层厚度对焊点显微组织及力学性能的影响。结果表明,焊点剪切强度随Sn层厚度的增加呈先上升后减小的趋势,当Sn层厚度为30~40μm时,自蔓延焊点具有良好的剪切强度。焊点呈现脆性断裂,断裂部位主要发生在陶瓷与镀镍层的交界处。Taking Al-Ni nano-multilayer film as the heat source of self-propagating exothermic reaction,Al_(2)O_(3)/Ni self-propagating solder joints were successfully prepared at room temperature.The microstructure,element distribution and phase composition of the cross-section and fracture surface of solder joints were characterized by scanning electron microscopy(SEM),X-ray energy dispersive spectrometer(EDS)and X-ray diffractometer(XRD).Effects of Sn layer thickness on microstructure and mechanical properties of solder joints were systematically investigated.The results indicate that the shear strength of solder joints is firstly increased and then decreased with the increase of Sn layer thickness,which reaches the desirable shear strength at 30~40μm.The solder joints are characterized by brittle fracture,which is mainly formed at the interface of ceramics and nickel coating.

关 键 词：Al_(2)O_(3)陶瓷 Al-Ni纳米膜 自蔓延燃烧反应 低温连接 

分 类 号：TG44[金属学及工艺—焊接] TG148[一般工业技术—材料科学与工程]