基于2.5D/3D封装集成电路的破坏性物理分析(DPA)方法研究  

Research on Destructive Physical Analysis(DPA)Methods for 2.5D/3D Packaged Integrated Circuits

作　　者：刘飞 赫兰齐 叶峻豪 曾鹏 Liu Fei;He Lanqi;Ye Junhao;Zeng Peng(GRGT Testing Group Co.,Ltd.,Guangzhou,Guangdong 511400)

机构地区：[1]广电计量检测集团股份有限公司,广东广州511400

出　　处：《产业科技创新》2024年第5期125-128,共4页Industrial Technology Innovation

摘　　要：本文通过对2.5D/3D封装集成电路DPA分析流程及方法的研究,提出了针对2.5D/3D封装的分析流程为先无损分析再进行破坏性分析,其中无损分析部分主要是通过无损成像技术进行内外部结构成像,由外观检查(3D OM),X射线成像检查(3D Xray),声学扫描显微镜检查(C-SAM)组成;破坏性分析部分主要是通过破坏性制样技术对待分析样品进行层层拆解后对各部分结构进行结构工艺及材料特性表征,由开封,取芯片,多层堆叠芯片分离,剖面制样,结构表征等组成。同时也对每个分析测试项目的实现方法作出了阐述。根据本文所述方法可以实现对2.5D/3D封装芯片进行结构解析。Through the research on the DPA analysis process and methods for 2.5D/3D packaged integrated circuits,this paper proposes an analysis process for 2.5D/3D packaging that involves non-destructive analysis followed by destructive analysis.The non-destructive analysis part mainly involves internal and external structural imaging using non-destructive imaging techniques,consisting of visual inspection(3D OM),X-ray imaging inspection(3D Xray),and acoustic scanning microscopy inspection(C-SAM).The destructive analysis part mainly involves layer-by-layer dissection of the sample under analysis using destructive sampling techniques,followed by structural process and material property characterization of each part,consisting of decapsulation,chip extraction,separation of multi-layer stacked chips,cross-sectional sample preparation,and structural characterization.The implementation methods for each analysis and testing project are also described.The method described in this paper can be used to perform structural analysis of 2.5D/3D packaged chips.

关 键 词：2.5D/3D封装 DPA分析 无损分析 破坏性分析 

分 类 号：TN4[电子电信—微电子学与固体电子学]