梯度灌封电路板结构的抗低速冲击性能  

Low Speed Impact Resistance of Gradient Encapsulated Circuit Board Structure

作　　者：朱秀芳 周宏元 张宏[1] 陈新民 ZHU Xiufang;ZHOU Hongyuan;ZHANG Hong;CHEN Xinmin(State Key Laboratory of Explosion Science and Safety Protection,Beijing Institute of Technology,Beijing 100081,China;Ningbo Institute of Materials Technology and Engineering,Chinese Academy of Sciences,Ningbo 315201,Zhejiang,China;Key Laboratory of Urban Security and Disaster Engineering of Ministry of Education,Beijing University of Technology,Beijing 100124,China)

机构地区：[1]北京理工大学爆炸科学与安全防护全国重点实验室,北京100081 [2]中国科学院宁波材料技术与工程研究所,浙江宁波315201 [3]北京工业大学教育部城市安全与灾害工程重点实验室,北京100124

出　　处：《兵工学报》2024年第11期3879-3891,共13页Acta Armamentarii

基　　金：国家自然科学基金青年项目(12002051);重庆市自然科学基金面上项目(cstc2021jcyj-msxmX0666)。

摘　　要：灌封防护可以增强电子设备的完整性,提高对外部冲击和振动的抵抗力,在汽车、船舶和兵器等领域得到了广泛应用。但传统的均质树脂灌封材料存在韧性不足、抗冲击能力较差的问题。针对这一问题,设计了碳纳米管(Carbon nanotubes,CNT)增强树脂基梯度灌封材料,并开展梯度灌封电路板结构的抗冲击性能研究。基于准静态拉伸试验和动态落锤冲击试验分析了不同CNT含量对树脂基体的增强效果以及不同梯度类型灌封结构的抗冲击性能,并通过有限元仿真得到了灌封层及内部电路板的能量吸收和损伤失效情况。研究结果表明:添加0.7 wt%CNT的灌封材料具有较高的拉伸强度,比纯环氧树脂提高了16%;V型梯度灌封板的冲击强度和临界破坏能量高于其他梯度类型,且比均质板提高了40%和15.8%;灌封材料的缓冲吸能对内部电子元件具有良好的防护作用,并且CNT含量较高的铺层吸能更高。提出的新型梯度灌封方式为冲击环境下的电子元件的防护设计提供了参考。Encapsulating protection has been widely used in automobiles,ships and weapons.It can enhance the integrity of electronic equipment and improve the resistance to external shocks and vibrations.However,the traditional homogeneous resin encapsulating materials have insufficient toughness and poor impact resistance.In response to this issue,this paper designs the resin gradient encapsulated materials reinforced with carbon nanotube(CNT)and studies the impact resistance of gradient encapsulated circuit board structure.The enhancing effects of different CNT contents on resin matrix and the impact resistance of gradient encapsulated structures are analyzed through quasi-static tensile tests and dynamic drop hammer impact tests.The energy absorptions of different gradient layers are obtained and the damage and failure of internal circuit boards are evaluated through finite element simulation analysis.The research results show that the encapsulating material with 0.7wt%CNT exhibits a higher tensile strength,which is 16%higher than that of pure epoxy resin;The impact strength and critical failure energy of V-shaped encapsulated gradient plate are higher than those of other gradient types,and are increased by 40%and 15.8%,respectively,compared to the homogeneous plate.The buffering and energy absorption properties of the encapsulating materials have a positive impact on the protection of internal electronic components,with the gradient layer containing a higher CNT content exhibiting an increased energy absorption.The gradient encapsulation method proposed in this paper provides a reference for the protection design of electronic components under impact environment.

关 键 词：灌封防护 梯度材料 能量吸收 抗冲击性能 电路板结构 

分 类 号：O341[理学—固体力学]