机构地区:[1]Institute for Advanced Interdisciplinary Research(iAIR),University of Jinan,Jinan,the People’s Republic of China [2]State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin,the People’s Republic of China [3]State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai,the People’s Republic of China [4]Institute for Materials Chemistry,Leibniz Institute for Solid State and Materials Research Dresden(IFW Dresden),Dresden,Germany [5]Lukasiewicz Research Network,PORT Polish Center for Technology Development,Wroclaw,Poland [6]State Key Laboratory of Advanced Materials for Smart Sensing,GRINM Group Co.Ltd,Beijing,the People’s Republic of China [7]Institute for Materials Science and Max Bergmann Center of Biomaterials,TUD Dresden University of Technology,Dresden,Germany [8]Department of Electronic Engineering,The Chinese University of Hong Kong,Hong Kong SAR,the People’s Republic of China [9]Institute of Environmental Technology,VSB-Technical University of Ostrava,Ostrava,Czech Republic [10]College of Energy,Soochow Institute for Energy and Materials Innovations,Soochow University,Suzhou,the People’s Republic of China [11]Key Laboratory of Advanced Carbon Materials and Wearable Energy Technologies of Jiangsu Province,Soochow University,Suzhou,the People’s Republic of China [12]Centre of Polymer and Carbon Materials,Polish Academy of Sciences,Zabrze,Poland [13]School of Integrated Circuits,University of Chinese Academy of Sciences,Beijing,the People’s Republic of China [14]Institute of Microelectronics of Tianjin Binhai New Area,Tianjin,the People’s Republic of China [15]Institute of Microelectronics,Chinese Academy of Sciences,Beijing,the People’s Republic of China [16]State Key Laboratory of Crystal Materials,Center of Bio and Micro/Nano Functional Materials,Shandong University,Jinan,the People’s Republic of China
出 处:《InfoMat》2024年第7期1-50,共50页信息材料(英文)
基 金:supported by National Key Research and Development Program(No.2022YFE0124200);National Natural Science Foundation of China(No.U2241221);J.P.thanks the Natural Science Foundation of Shandong Province for Excellent Young Scholars(YQ2022041);the fund(No.SKT2203)from the State Key Laboratories of Transducer Technology;Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences for support.;W.Z.thanks the Major Scientific and Technological Innovation Project of Shandong Province(2021CXGC010603);NSFC(No.52022037);Taishan Scholars Project Special Funds(TSQN201812083);The Project was supported by the Foundation(No.GZKF202107)of State Key Laboratory of Biobased Material and Green Papermaking;Qilu University of Technology,Shandong Academy of Sciences.M.H.R.thanks NSFC(No.52071225);the National Science Center and the Czech Republic under the European Regional Development Fund(ERDF)“Institute of Environmental Technology-Excellent Research”(No.CZ.02.1.01/0.0/0.0/16_019/0000853);the SinoGerman Center for Research Promotion(SGC)for support(No.GZ 1400).
摘 要:Flexible electronics has emerged as a continuously growing field of study.Two-dimensional(2D)materials often act as conductors and electrodes in elec-tronic devices,holding significant promise in the design of high-performance,flexible electronics.Numerous studies have focused on harnessing the potential of these materials for the development of such devices.However,to date,the incorporation of 2D materials in flexible electronics has rarely been summa-rized or reviewed.Consequently,there is an urgent need to develop compre-hensive reviews for rapid updates on this evolving landscape.This review covers progress in complex material architectures based on 2D materials,including interfaces,heterostructures,and 2D/polymer composites.Addition-ally,it explores flexible and wearable energy storage and conversion,display and touch technologies,and biomedical applications,together with integrated design solutions.Although the pursuit of high-performance and high-sensitivity instruments remains a primary objective,the integrated design of flexible electronics with 2D materials also warrants consideration.By combin-ing multiple functionalities into a singular device,augmented by machine learning and algorithms,we can potentially surpass the performance of existing wearable technologies.Finally,we briefly discuss the future trajectory of this burgeoning field.This review discusses the recent advancements in flex-ible sensors made from 2D materials and their applications in integrated archi-tecture and device design.
关 键 词:2D materials biomedical healthcare energy storage and conversion flexible electronics HETEROSTRUCTURES SENSORS
分 类 号:TB34[一般工业技术—材料科学与工程]
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