聚酰亚胺胶黏剂在印刷电路板(PCB)制造中的应用现状及展望  

Application Status and Prospects of Polyimide Adhesives in Printed Circuit Board(PCB)Manufacturing

作　　者：李晓鹏[1] 鞠春红[1] 王天亮[2] 徐鑫[1] 姜洋[3] Li Xiaopeng;Ju Chunhong;Wang Tianliang;Xu Xin;Jiang Yang(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China;Heilonjiang Academy of Sciences,Harbin 150001,China;Institute for Advanced Technology of HAS,Harbin 150020,China)

机构地区：[1]黑龙江省科学院石油化学研究院,哈尔滨150040 [2]黑龙江省科学院,哈尔滨150001 [3]黑龙江省科学院高技术研究院,哈尔滨150020

出　　处：《黑龙江科学》2024年第22期101-104,共4页Heilongjiang Science

摘　　要：探讨了聚酰亚胺胶黏剂在印刷电路板(PCB)制造中的国内外研究进展、特殊应用、环保标准适应性及市场动态。国外在聚酰亚胺胶黏剂研究方面的技术创新较为显著,尤其是在环保性能和高温稳定性方面。我国尽管在传统应用领域取得了进展,但在材料创新和环保应用方面仍有提升空间。通过对比分析国内外研究差异提出在高性能聚酰亚胺胶黏剂的开发上应加强材料创新与环保技术的融合,以促进PCB行业的可持续发展。This study discusses the application status and future prospects of polyimide adhesives in printed circuit board(PCB)manufacturing,including domestic and foreign research progress,special applications,adaptability to environmental standards and market dynamics.The technological innovation in the research of polyimide adhesives abroad is relatively remarkable,especially in the aspects of environmental protection performance and high temperature stability.Although China has made progress in traditional applications,material innovation and environmental protection application still needs to be improved.This paper identifies the differences between domestic and foreign research through comparative analysis,and proposes that domestic research should strengthen the integration of material innovation and environmental protection technology in the development of high-performance polyimide adhesives,so as to promote the sustainable development of PCB industry.

关 键 词：聚酰亚胺胶黏剂 印刷电路板制造 应用现状 

分 类 号：TQ433.4[化学工程]