倒装集成电路可靠性研究  

Study on Reliability of Flip Chip Integrated Circuits

作　　者：李锟[1] LI Kun(China Electronics Standardization Institute)

机构地区：[1]中国电子技术标准化研究院

出　　处：《中国标准化》2024年第23期198-203,共6页China Standardization

摘　　要：随着封装技术的发展,倒装焊技术在集成电路领域的应用日益广泛,其可靠性问题也受到了更多的关注。本文深入探讨了倒装集成电路的结构特点、失效模式,并对关键工艺过程进行了系统分析。通过工艺试验方法的研究和试验验证,提出了倒装集成电路的工艺过程试验检验要求,并对X射线和超声检测的判据进行了试验确认。With the advancement of packaging technology,flip chip technology has been widely applied in the field of integrated circuits,and more attention has been attached to its reliability.This paper thoroughly discusses the structural characteristics and failure modes of flip chip integrated circuits,and systematically analyzes the key processes.Through the research and experimental verification of process testing methods,this paper proposes the testing requirements for the process of flip chip integrated circuits and confirms the criteria for X-ray and ultrasonic testing through experiments.

关 键 词：倒装 失效判据 试验 

分 类 号：TN405[电子电信—微电子学与固体电子学]