6H-SiC高速纳米磨削的去除行为及亚表面损伤机制的分子动力学仿真研究  

Molecular Dynamics Simulation of Removal Behavior and Subsurface Damage Mechanism in High Speed Nano-grinding of 6H-SiC

作　　者：耿瑞文 双佳俊 谢启明[3] 杨志豇 周星辰 李立军 GENG Ruiwen;SHUANG Jiajun;XIE Qiming;YANG Zhijiang;ZHOU Xingchen;LI Lijun(Hubei Engineering Research Center of Graphite Additive Manufacturing Technology and Equipment,China Three Gorges University,Yichang Hubei 443002,China;College of Mechanical and Power Engineering,China Three Gorges University,Yichang Hubei 443002,China;Kunming Institute of Physics,Kunming Yunnan 650223,China)

机构地区：[1]三峡大学石墨增材制造技术与装备湖北省工程研究中心,湖北宜昌443002 [2]三峡大学机械与动力学院,湖北宜昌443002 [3]昆明物理研究所,云南昆明650223

出　　处：《机床与液压》2024年第21期191-198,共8页Machine Tool & Hydraulics

基　　金：湖北省技术创新专项重大项目(2019AAA164);三峡大学人才引进项目(2022Y0037)。

摘　　要：6H-SiC在光电子等领域应用广泛,作为典型的硬脆性材料,其材料去除行为及亚表面损伤机制目前尚不清晰,高效地获得光滑、平坦、低损伤的表面仍十分困难。采用分子动力学模拟的方法研究磨削速度对6H-SiC去除行为及亚表面损伤的影响。结果表明:磨削时原子层有两条去除路径,即向左上方形成切屑,向右下方形成加工表面。在磨削深度为1 nm、磨削速度为100 m/s的条件下,工件通过相变、堆垛层错、晶格畸变和原子空位产生塑性变形,从而导致工件材料的去除。随着磨削速度增加,磨粒所受的平均切向磨削力和摩擦因数都减小。相比100 m/s,磨削速度为200、400 m/s时,平均切向磨削力分别减少了52.3%和55%,摩擦因数分别减少了7.4%和11.9%。增大磨削速度可以减小工件亚表层的损伤深度,提高工件表面材料的去除率,改善工件表面的加工质量。6H-SiC is widely used in fields such as optoelectronics.As a typical hard and brittle material,its material removal behavior and subsurface damage mechanism are currently unclear.It is still very difficult to efficiently obtain a smooth,flat,and low-damage surface.Molecular dynamics simulation methods were used to study the effect of grinding speed on the removal behavior and subsurface damage of 6H-SiC.The results show that there are two removal paths for the atomic layer during grinding,namely to the upper left chips are formed and to the lower right the machined surface is formed.Under the conditions of a grinding depth of 1 nm and a grinding speed of 100 m/s,the workpiece undergoes plastic deformation through phase transformation,stacking faults,lattice distortion,and atomic vacancies,resulting in the removal of workpiece material.As the grinding speed increases,the average tangential grinding force and friction coefficient experienced by the abrasive particles decrease.Compared with the case of 100 m/s,when the grinding speed is 200 m/s and 400 m/s,the average tangential grinding force is reduced by 52.3%and 55%respectively,and the friction coefficient is reduced by 7.4%and 11.9%respectively.Increasing the grinding speed can reduce the damage depth of the subsurface layer of the workpiece,increase the removal rate of surface material on the workpiece,and improve the processing quality of the workpiece surface.

关 键 词：6H-SIC 分子动力学 材料去除行为 亚表面损伤机制 高速纳米磨削 

分 类 号：TH117.1[机械工程—机械设计及理论]