基于MEMS喷墨打印芯片的低应力封装基板设计  

Design of low-stress packaging substrate based on MEMS inkjet printed chip

作　　者：冯东东 王伟 葛胜 关一民 FENG Dongdong;WANG Wei;GE Sheng;GUAN Yimin(School of Microelectronics,Shanghai University,Shanghai 201800,China;Shanghai IndustrialμTechnology Research Institute,Shanghai 200000,China;Shanghai Aure Technology Co Ltd,Shanghai 200000,China)

机构地区：[1]上海大学微电子学院,上海201800 [2]上海微技术工业研究院,上海200000 [3]上海傲睿科技有限公司,上海200000

出　　处：《传感器与微系统》2024年第12期93-95,共3页Transducer and Microsystem Technologies

摘　　要：喷墨打印芯片基于MEMS技术制备而成,内部集成有液体驱动MEMS结构,而MEMS结构本质是应力敏感的,因此封装过程产生的应力将会严重影响MEMS喷墨打印芯片的可靠性和长期稳定性。本文基于MEMS喷墨打印芯片,从结构和材料两方面考虑,设计出3种不同形式的封装基板,即有圆柱形聚苯硫醚(PPS)树脂基板,无圆柱形PPS树脂基板和无圆柱形陶瓷基板,通过有限元仿真和实际测量相结合的方式对3种基板进行验证,最终得出3组封装基板中应力最小的为无圆柱形陶瓷基板。仿真分析与实际结果相符合,证明本文设计能够有效降低MEMS喷墨打印芯片封装结构的应力。Inkjet printed chip is fabricated based on MEMS technology with liquid-driven MEMS structures integrated inside,and MEMS structures are stress-sensitive by nature,so the stress generated by packaging process will seriously affect the reliability and long-term stability of MEMS inkjet printed chip.Based on MEMS inkjet printed chip,three different types of packaging substrates are designed from both structural and material aspects,i.e.,cylindrical PPS resin substrate,non-cylindrical PPS resin substrate and non-cylindrical ceramic substrate,and the three kinds of substrates are verified by combination of finite element simulation and actual measurements,and finally the least stress among the three groups of packaging substrates is the non-cylindrical ceramic substrate.The simulation analysis is consistent with the actual results,which proves that this design can effectively reduce the stress in the MEMS inkjet printed chip package structure.

关 键 词：封装应力 基板设计 仿真分析 实际测量 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置] TB301[自动化与计算机技术—控制科学与工程]