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作 者:唐忠辉 Tang Zhonghui(Zhaoqing Honghua Electronic Technology Co.,Ltd.,Zhaoqing,Guangdong 526060,CHN)
机构地区:[1]肇庆市宏华电子科技有限公司,广东肇庆526060
出 处:《模具制造》2024年第12期137-139,共3页Die & Mould Manufacture
摘 要:薄膜的丝印制备工艺在确保陶瓷薄膜的均匀性、厚度精度和表面质量方面起着决定性作用。然而,丝印工艺在实际应用中极易受到材料特性、印刷工艺参数、环境条件等多种因素的影响,从而产生一系列缺陷,这不仅影响了陶瓷薄膜的功能,还可能导致电子元件在应用中的失效。本研究对精密电子陶瓷薄膜丝印制备工艺中的缺陷进行了比较深入的分析,在此基础上,进一步提出了针对性的缺陷控制与改善策略,进而为提高精密电子陶瓷薄膜丝印制备工艺的可靠性提供了技术支持,有助于推动微电子产品制造的长远发展。The silk screen printing process of thin films plays a decisive role in ensuring the uniformity,thickness accuracy,and surface quality of ceramic films.However,silk screen printing technology is highly susceptible to various factors such as material properties,printing process parameters,environmental conditions,etc.in practical applications,resulting in a series of defects that not only affect the functionality of ceramic films,but may also lead to the failure of electronic components in application.This study provides a comprehensive analysis of the defects in the preparation process of precision electronic ceramic film screen printing.Based on this,targeted defect control and improvement strategies are further proposed,which provides technical support for improving the reliability of precision electronic ceramic film screen printing preparation process and helps promote the long-term development of microelectronic product manufacturing.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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