数据中心芯片级间接液冷技术与强化传热进展  

Progress of chip-level indirect liquid cooling technology and enhanced heat transfer in data centers

作　　者：尹瑞 尹少武 杨立坤 童莉葛 刘传平 王立 YIN Rui;YIN Shaowu;YANG Likun;TONG Lige;LIU Chuanping;WANG Li(School of Energy and Environmental Engineering,University of Science and Technology Beijing,Beijing 100083,China;School of Energy Engineering,Xinjiang Institute of Engineering,Urumqi 830023,Xinjiang,China)

机构地区：[1]北京科技大学能源与环境工程学院,北京100083 [2]新疆工程学院能源工程学院,新疆乌鲁木齐830023

出　　处：《化工进展》2024年第11期6010-6030,共21页Chemical Industry and Engineering Progress

基　　金：国家重点研发计划(2022YFC3800401);新疆维吾尔自治区自然科学基金面上项目(2023D01A79)。

摘　　要：为了满足高热通量数据中心的工作需求,液冷技术得到国内外学者的重视与研究。间接液冷比传统的风冷技术更具效率、更节能,但较直接接触式液冷传热能力有所减弱,因而强化传热就成为间接液冷的研究重点。此外,间接液冷存在安全或成本问题,如漏液、系统复杂等,因而基于技术优劣、将不同技术综合利用也成为当下数据中心冷却系统有意义的研究方向。本文对这些关键方面进行全面回顾,系统分析了当前单相、双相以及热管冷却在芯片级数据中心冷却的应用现状以及研究进展,从流体动力、介质材料以及流道设计优化三个方面梳理了芯片间接液冷中强化传热的途径。还整理了复合不同技术的芯片级数据中心冷却方式,主要包括单相冷却及热管冷却、相变材料与单相冷却或热管的组合,旨在探索更加节能高效的冷却形式。未来数据中心间接液冷仍需要在散热效率提升及技术复合方向进行拓展。本研究能为提升高温数据中心的冷却效率、拓展间接液冷技术应用提供参考。In order to meet the operational requirements of high-heat-flux data centers,liquid cooling technology has gotten more and more attention and research efforts from scholars worldwide.Indirect liquid cooling is regarded as more efficient and energy-saving compared to traditional air cooling methods.However,its heat exchange capabilities are somewhat diminished in comparison to direct liquid contact methods,making the heat transfer enhancement a focal point of research in the realm of indirect liquid cooling.Additionally,indirect liquid cooling presents safety and cost-related challenges,such as liquid leakage and system complexity.Therefore,the integration of different technologies based on their respective strengths and weaknesses has become a meaningful research direction for current data center cooling systems.In this article,a comprehensive review of these key aspects is conducted.The current status and research advancements in the application of single-phase,two-phase,and heat pipe cooling in chip-level data center cooling are thoroughly analyzed.The pathways for enhancing heat transfer in chip-level indirect liquid cooling are outlined from three aspects:fluid dynamics,medium materials,and channel design optimization.Furthermore,the coupling of different technologies for chip-level data center cooling methods has also been organized,primarily including single-phase cooling and heat pipe cooling,along with the use of phase-change materials in conjunction with these methods to enhance energy efficiency and effectiveness.In the future,indirect liquid cooling in data centers still needs to be expanded in the direction of heat dissipation efficiency improvement and technology composite.This study provides a valuable reference for improving the cooling efficiency of high-temperature data centers and expanding the application of indirect liquid cooling technology.

关 键 词：传热 流体动力学 相变 微通道 优化设计 

分 类 号：TB611[一般工业技术—制冷工程] TU244.5[建筑科学—建筑设计及理论]