Growth kinetics of interfacial intermetallic compounds formed in SnPbInBiSb high entropy alloy soldered joints on Cu substrates  

铜基体上SnPbInBiSb高熵钎料焊点界面金属间化合物的生长动力学

作　　者：Shuai WANG Jia-yun FENG Wei WANG Wen-chao CAO Xin DING Shang WANG Yan-hong TIAN 王帅;冯佳运;王玮;曹文超;丁鑫;王尚;田艳红(哈尔滨工业大学材料结构精密焊接与连接全国重点实验室,哈尔滨150001;哈尔滨工业大学金属精密热加工国家级重点实验室,哈尔滨150001;哈尔滨工业大学郑州研究院,郑州450041)

机构地区：[1]State Key Laboratory of Precision Welding and Joining of Materials and Structures,Harbin Institute of Technology,Harbin 150001,China [2]National Key Laboratory for Precision Hot Processing of Metals,Harbin Institute of Technology,Harbin 150001,China [3]Zhengzhou Research Institute,Harbin Institute of Technology,Zhengzhou 450041,China

出　　处：《Transactions of Nonferrous Metals Society of China》2024年第11期3650-3661,共12页中国有色金属学报（英文版）

基　　金：supported by the National Natural Science Foundation of China (No.U2241223);the Heilongjiang Touyan Innovation Team Program,China (No.HITTY-20190013);the Fundamental Research Funds for the Central Universities,China (No.AUEA5770400622)。

摘　　要：The growth behavior of the complex intermetallic compounds(IMCs)formed at the interface of Cu/SnPbInBiSb high entropy alloy solder joints was explored.The growth inhibition mechanism of the IMCs at the Cu/SnPbInBiSb solid−liquid reaction interface was revealed.The results showed that the growth rate of the complex IMCs obviously decreased at the Cu/SnPbInBiSb solid−liquid reaction interface.The maximum average thickness of IMCs only reached up to 1.66μm after reflowing at 200℃for 10 min.The mechanism for the slow growth of the complex IMCs was analyzed into three aspects.Firstly,the high entropy of the liquid SnPbInBiSb alloy reduced the growth rate of the complex IMCs.Secondly,the distorted lattice of complex IMCs restrained the diffusion of Cu atoms.Lastly,the higher activation energy(40.9 kJ/mol)of Cu/SnPbInBiSb solid−liquid interfacial reaction essentially impeded the growth of the complex IMCs.研究低温长时间回流后高熵钎料Cu/SnPbInBiSb焊点界面复杂金属间化合物(IMCs)的生长行为,并揭示Cu/SnPbInBiSb固-液反应界面IMCs生长的抑制机理。研究发现,在Cu/SnPbInBiSb固-液反应界面形成的复杂IMC生长速度明显减慢。在最高回流温度200℃回流10min后界面IMCs的最大平均厚度仅为1.66μm。复杂IMCs缓慢生长的机理归纳为三点:首先,液态SnPbInBiSb高熵钎料的高熵状态降低了复杂IMCs的生长速率;其次,复杂IMC变形的晶格结构阻碍了Cu原子的扩散;最后,Cu/SnPbInBiSb固-液界面反应具有更高的激活能(40.9 kJ/mol),实质上阻碍了复杂IMCs的生长。

关 键 词：high entropy alloy interfacial reaction microstructure evolution growth kinetics intermetallic compounds 

分 类 号：TG425[金属学及工艺—焊接]