Heterodimensional structure with enhanced interface loss for microwave absorption and EMI shielding  

用于微波吸收和电磁干扰屏蔽的具有增强界面损耗的异维结构

作　　者：Hong-Zhou Guan Zhan-Zhan Wang Meng-Qi Wang Hua-Zhang Zhai Mao-Sheng Cao 管洪州;王站站;王梦奇;翟华嶂;曹茂盛

机构地区：[1]School of Materials Science and Engineering,Beijing Institute of Technology,Beijing 100081,China

出　　处：《Science China Materials》2024年第12期4021-4030,共10页中国科学（材料科学）（英文版）

基　　金：supported by the National Natural Science Foundation of China (52373280, 52273257, 52177014, and 51977009)。

摘　　要：The study of high-performance multifunctional electromagnetic materials is one of the inevitable challenges in the field of electromagnetic wave(EMW)absorption.In order to improve the attenuation ability of EMW and broaden the frequency range of absorbing materials,rational design of material structure and interface is an important way to optimize the effective absorption bandwidth(EAB).Therefore,enhanced-interface and strongly polarized CuS/Ti_(3)C_(2)T_(X) composites were successfully synthesized by in-situ etching,sacrificial template and freeze-drying techniques.Its EMW absorption performance was improved by optimizing the hybridization ratio and loading content.The maximum reflection loss of CuS@Ti_(3)C_(2)T_(X)(mass ratio=5:5)is−54.6 dB and the maximum EAB covering the major of Ku band is 4.72 GHz due to the interface polarization,multiple scattering and dipole polarization.In addition,the electromagnetic interference shielding performance of CuS@Ti_(3)C_(2)T_(X)(mass ratio=3:7)is up to 23.9 dB.A new heterodimensional structure was developed by the spherical structure and lamellar,which realizes the broadband EMW absorption and electromagnetic protection.研究高性能的多功能电磁材料是吸波领域的挑战之一.为提高电磁波衰减能力、拓宽吸波材料的应用范围,合理设计材料结构和界面是优化其有效吸收带宽的重要途径.因此,本文采用原位刻蚀法、牺牲模板法和冷冻干燥技术成功制备了多界面、强极化的异维CuS/Ti_(3)C_(2)T_(X)复合材料.通过优化CuS/Ti_(3)C_(2)T_(X)的复合比例和负载量,改进其吸波性能.CT55的最大RL可达到−54.6 dB,EAB达到4.72 GHz,几乎覆盖Ku波段.优良的吸波性能得益于CuS/Ti_(3)C_(2)T_(X)的界面极化、多重散射和偶极子极化.此外,CT37还具有高达23.9 dB的屏蔽性能.将球形结构与片层结构设计为新型“异维”结构,实现了宽带微波吸收和电磁防护.

关 键 词：heterodimensional structure CuS/Ti_(3)C_(2)T_(X) microwave absorption 

分 类 号：TB34[一般工业技术—材料科学与工程]