集成电路电磁兼容性分析方法及展望  

Methods and Prospects for Electromagnetic Compatibility Analysis of Integrated Circuits

作　　者：阎照文[1] Yan Zhaowen

机构地区：[1]北京航空航天大学

出　　处：《安全与电磁兼容》2024年第6期9-21,共13页Safety & EMC

基　　金：国家自然科学基金(No.62293493)。

摘　　要：文章给出了集成电路电磁兼容性的含义和需要研究的内容,简单介绍了集成电路电磁兼容性分析所涉及的三种测试方法、四种建模方法以及防护方面的核心技术方向,给出了一些精准测试、准确建模、正向设计方法的案例参考。这些方法将为芯片供应商、产品研制单位提供基于集成电路电磁兼容性测试结果和模型的电磁防护正向设计方法的思路和建议,为芯片和产品的电磁可靠性提升提供发展方向。This paper provides the meaning of integrated circuit electromagnetic compatibility and the content that needs to be analyzed.It briefly introduces core technical directions of the three testing methods,four modeling methods,and protection involved in integrated circuit electromagnetic compatibility analysis.It also provides some case references for precise testing,accurate modeling,and forward design methods,providing chip suppliers and product development manufacturers with ideas and suggestions for electromagnetic protection forward design methods based on integrated circuit electromagnetic compatibility testing results and models,and providing future development directions for improving the electromagnetic reliability of chips and products.

关 键 词：集成电路 电磁兼容性 精准测试 准确建模 电磁防护 正向设计 

分 类 号：TN03[电子电信—物理电子学] TN40