漫话半导体先进封装技术中的新网版印刷(三)  

New Screen Printing in Advanced Packaging Technology for Semiconductors(part3)

作　　者：熊祥玉 巢亚平 陈港能 李蓉 XIONG Xiangyu;CHAO Yaping;CHEN Gangneng;LI Rong

机构地区：[1]不详

出　　处：《丝网印刷》2024年第22期21-26,共6页Screen Printing

摘　　要：介绍FC技术、WLCSP封装技术的优势。FC技术与网版印刷技术渊源颇深,其焊接结束也是包括网版印刷技术在内的SMT技术;WLCSP封装符合目前包括网版印刷技术在内的SMT技术的潮流,把封装与芯片制造融为一体,改变芯片制造业与芯片封装业分离的局面。The advantages of FC technology and WLCSP packaging technology are introduced.The origin of FC technology and screen printing technology is quite deep,and its welding end is also SMT technology including screen printing technology;WLCSP package is in line with the current trend of SMT technology,including screen printing technology,integrates packaging and chip manufacturing,and changes the separation of chip manufacturing and chip packaging industry.

关 键 词：FC技术 WLCSP封装技术 集成产品 网印技术 

分 类 号：TN405[电子电信—微电子学与固体电子学]