聚晶金刚石中D-D键的表征方法进展  

Progress in methods for characterisation of D-D bonds in polycrystalline diamond

作　　者：陈美全 黄凯[1] CHEN Meiquan;HUANG Kai(School of Metallurgical and Ecological Engineering,University of Science and Technology Beijing,Beijing 100083,China)

机构地区：[1]北京科技大学冶金与生态工程学院,北京100083

出　　处：《超硬材料工程》2024年第6期51-55,61,共6页Superhard Material Engineering

摘　　要：聚晶金刚石复合片中的金刚石晶粒之间形成D-D键的程度,对复合层的硬度、强度、耐磨性等宏观性能有着十分重要的影响。因此,对D-D键的成键程度进行定量表征是聚晶复合片设计与生产乃至应用过程中的关键任务。文章综述了5种表征D-D成键状态的方法(SEM法、孔隙度法、XRD法、三点抗弯法、耐磨性测试法),对其原理进行了探讨,为聚晶金刚石材料中D-D成键情况乃至诸多宏观性能的定量描述提供有益的参考。The degree to which D-D bonds are formed between diamond grains in diamond polycrystalline composite sheets has a significant impact on the macroscopic properties of the composite layer,such as hardness,strength,and wear resistance.Therefore,quantitative characterization of the degree of D-D bonding is a key task in the design,production,and even application of polycrystalline composite sheets.The article reviews five methods for characterizing the bonding state of D-D(SEM method,porosity method,XRD method,three-point bending resistance method,and wear resistance testing method),and explores their principles,providing useful references for the quantitative description of D-D bonding and many macroscopic properties in diamond polycrystalline materials.

关 键 词：聚晶金刚石 D-D键 D-Co-D键 定量表征方法 

分 类 号：TQ164[化学工程—高温制品工业]