Creep properties of bimetal Al/SiC/Cu compositesfabricated via accumulative roll bonding process  

通过累积轧制工艺制备的Al/SiC/Cu双金属复合材料的蠕变性能

作　　者：Basem Ali Jasim Dheyaa J Bansal Pooja Qasim Maytham T Brisset B.J 

机构地区：[1]Faculty of Engineering,Warith Al-Anbiyaa University,Karbala 56001,Iraq [2]Department of Petroleum Engineering,Al-Amarah University College,Maysan,Iraq [3]Department of Biotechnology and Genetics,Jain(Deemed-to-be)University,Bengaluru,Karnataka-560069,India [4]Department of Allied Healthcare and Sciences,Vivekananda Global University,Jaipur,Rajasthan-303012,India [5]College of Health and Medical Technology,Al-Ayen University,Thi-Qar,64001,Iraq [6]Institut des Matériaux Jean Rouxel(IMN),UMR 6502,Polytech'Nantes,Nantes Cedex,France

出　　处：《Journal of Central South University》2024年第10期3807-3818,共12页中南大学学报（英文版）

摘　　要：In the present study,microstructural evolution,mechanical and creep properties of Al/SiC/Cu composite stripsfabricated via accumulative roll bonding(ARB)process were studied.The obtained results showed the formation of anatomic diffusion layer with thickness of about 17μm at the interface during the ARB under three creep loadingconditions namely 30 MPa at 225℃,35 MPa at 225℃,and 35 MPa at 275℃.An generated intermetallic compoundresulted in a 40%increase of interface thickness near Al.The stress level decreased by 13%at constant temperature withno signi fi cant effect on the interface thickness,and the creep failure time declined by 44%.It was observed that atconstant temperatures,the second slope of the creep curve reached to 39%with increasing stress level,then,it dropped to2%with a little temperature rising.After creep test under 35 MPa at 275℃,the sample displays the presence of 60%Aland 40%Cu,containing brittle Al_(2)Cu intermetallic compound at the interface.Applied temperature and stress had effecton the creep properties,specially increasing the slope of creep curves with higher stresses.本文研究了通过累积辊压结合(ARB)工艺制备的Al/SiC/Cu复合带材的微观结构演变、力学和蠕变性能。在三种蠕变载荷条件下,即225℃/30 MPa、225℃/35 MPa和275℃/35 MPa,在ARB过程中材料的界面处形成了厚度约17μm的原子扩散层。生成的金属间化合物导致Al附近的界面厚度增加了40%。在恒温下,应力水平降低了13%,对界面厚度没有显著影响,蠕变失效时间缩短了44%。在恒定温度下,蠕变曲线的第二斜率随着应力水平的增加而达到39%,然后随着温度的小幅升高而降至2%。在275℃/35 MPa下进行蠕变试验,样品含60%Al和40%Cu,界面处有脆性的Al_(2)Cu金属间化合物。实验温度和应力对蠕变性能有影响,特别是应力越高,蠕变曲线的斜率越大。此外,通过晶体结构检测到动态再结晶。

关 键 词：creep property intermetallic compounds accumulative roll bonding MICROSTRUCTURE BIMETAL 

分 类 号：TG335.8[金属学及工艺—金属压力加工]