铜板带工艺技术在高导电材料制备中的应用研究  

Research on the Application of Copper Strip Process Technology in the Preparation of High Conductivity Materials

作　　者：熊哲思 Xiong Zhesi(Jiangxi Copper Industry Group Copper Strip Co.,Ltd.,Nanchang Jiangxi 330096,China)

机构地区：[1]江西铜业集团铜板带有限公司,江西南昌330096

出　　处：《山西冶金》2024年第10期222-224,共3页Shanxi Metallurgy

摘　　要：高导电材料在现代电子、能源和通信等领域具有重要的应用价值,然而,传统制备方法存在成本高、工艺复杂等问题。对此,主要阐述了铜板带工艺技术在高导电金属材料制备中的应用案例,包括高纯度铜、银、铝等材料的制备,以及其在导电高分子复合材料中的应用。通过实验探讨了铜板带工艺参数对材料导电性能的影响,并提出了工艺优化策略。该研究可为高导电材料制备领域的进一步研究提供新思路和方法。Highly conductive materials have important application value in modern electronics,energy,and communication fields.However,traditional preparation methods have problems such as high cost and complex processes.This article mainly elaborates on the application cases of copper strip technology in the preparation of highly conductive metal materials,including the preparation of high-purity copper,silver,aluminum and other materials,as well as their application in conductive polymer composite materials.Through experiment the influence of copper strip process parameters on material conductivity was explored,and process optimization strategies were proposed.This study can provide new ideas and methods for further research in the field of high conductivity material preparation.

关 键 词：铜板带工艺 高导电材料 制备 

分 类 号：TB302.1[一般工业技术—材料科学与工程]