粗化预电镀引线框架的可键合性研究  

Research on the bondability of roughen pre-electroplated lead frame

作　　者：张德良 朱林 郑浩帅 杨永学 黄伟 赵耀军 Zhang Deliang;Zhu Lin;Zheng Haoshuai;Yang Yongxue;Huang Wei;Zhao Yaojun(Henghui Technology Co.,Ltd.,Zibo 255000,China)

机构地区：[1]新恒汇电子股份有限公司,山东淄博255000

出　　处：《电镀与精饰》2024年第12期107-113,共7页Plating & Finishing

基　　金：超大规模集成电路用高精度引线框架研发及产业化(2019TSLH0216)。

摘　　要：本文采用技术验证与统计学检验方法,使用自主研发的一款电镀粗镍用电化学沉积液,制备了粗化预电镀引线框架产品,并对产品可键合性能的影响因素进行了研究。研究结果表明,通过优化粗镍用电化学沉积液中的分散剂含量以及金层、钯层、镍层的厚度,可显著提升粗化预电镀引线框架的可键合性,制备出的粗化预电镀引线框架产品的键合性能完全满足行业内的应用要求,有望实现该类产品的国产化替代。Using technical validation and statistical testing methods,a self-developed electrochemical deposition solution for electroplating rough nickel was used to prepare a roughened pre-electroplated lead frame product,and the influencing factors of the product's bonding performance were studied.The research results indicate that by optimizing the dispersant content in the electrochemical deposition solution for rough nickel and the thickness of the gold layer,palladium layer and nickel layer,the bondability of the roughened pre-electroplated lead frames can be significantly improved.The bonding performance of the prepared roughened pre-electroplated lead frame products fully meets the application requirements in the industry,and it is expected to achieve domestic substitution of such products.

关 键 词：电镀粗镍 电化学沉积液 引线框架 统计学检验 

分 类 号：TN405[电子电信—微电子学与固体电子学]