荧光光谱法测定镀铜溶液主盐含量的误差分析  

Error analysis of measurements of main salt content in copper electroplate baths by fluorescence spectrometry

作　　者：吴煜 田继红[1] 唐方宇 邵波 田礼熙 章瀚文 Wu Yu;Tian Jihong;Tang Fangyu;Shao Bo;Tian Lixi;Zhang Hanwen(School of Materials Science and Engineering,Nanchang Hangkong University,Nanchang 330063,China;CFAN Instrument Co.,Ltd.,Shenzhen 518000,China)

机构地区：[1]南昌航空大学材料科学与工程学院,江西南昌330063 [2]深圳西凡仪器有限公司,广东深圳518000

出　　处：《电镀与精饰》2024年第12期120-128,共9页Plating & Finishing

摘　　要：通过无标样法对荧光光谱曲线进行校准,采用校准后的曲线快速分析酸性硫酸铜和HEDP络合物铜电镀液的主盐Cu2+含量,并借助于成对二样本t检验将其与化学滴定法的测试结果进行比较。研究结果表明,两种分析方法对单盐体系镀液和络合物体系镀液的测量结果的相对误差范围分别为-3.96%~3.24%和3.01%~4.99%,均在工艺容许范围以内。相比于化学滴定法,荧光光谱法的测量结果的精密度更高,速度更快,操作更加简便,且校准后的测试结果可以进一步逼近真值。The fluorescence spectrum curves were calibrated by the non-standard sample method,and then the main salt Cu2+content of the acid copper sulfate bath and the HEDP complex copper bath was analyzed by the calibrated curve rapidly.The results were compared with those of the chemical titration method by the paired two-sample t test,they showed that the relative error ranges between the two analytical methods for the single salt system and the complex system are−0.36%±3.6%and 0.99%±4.0%,respectively,which are within the allowed ranges of the process.The measurement results of fluorescence spectrometry have higher precision,faster speed and simpler operation compared with the chemical titration method,while the test results could further approach the true value after being calibrated.

关 键 词：荧光光谱法 化学滴定法 快速分析 成对二样本t检验 电镀液 

分 类 号：O655.25[理学—分析化学]