电沉积铱镍薄膜电催化剂及其析氢性能  

Electrodeposition and hydrogen evolution performance of Ir-Ni thin film electrocatalysts

作　　者：张美霞 吴王平[3] 王芹芹 Zhang Meixia;Wu Wangping;Wang Qinqin(Institute of Technology for Carbon Neutralization,Yangzhou University,Yangzhou 225101,China;Yangzhou Technological Innovation Institute for Carbon Neutralization,Yangzhou University,Yangzhou 225101,China;Electrochemistry and Corrosion Laboratory,School of Mechanical Engineering and Rail Transit,Changzhou University,Changzhou 213164,China)

机构地区：[1]扬州大学碳中和技术研究院,江苏扬州225101 [2]扬州大学扬州碳中和技术创新研究中心,江苏扬州225101 [3]常州大学机械与轨道交通学院电化学与腐蚀实验室,江苏常州213164

出　　处：《电镀与精饰》2024年第12期136-144,共9页Plating & Finishing

摘　　要：采用电沉积技术在泡沫铜上制备了铱镍(Ir-Ni)合金薄膜,并利用泡沫铜(CF)的三维多孔结构和Ir-Ni合金的优良催化及抗腐蚀性来提升薄膜的电催化析氢反应(HER)性能。本文在恒电流条件下通过电沉积技术在泡沫铜上制备了Ir-Ni薄膜,并与泡沫铜上电沉积制备的纯Ir和纯Ni薄膜进行了比较。通过扫描电子显微镜(SEM)、能谱仪(EDS)和X射线光电子能谱仪(XPS)分析了薄膜的表面形貌和化学成分,采用线性扫描伏安法(LSV)测试了其电催化性能。结果表明:Ir-Ni薄膜成功附着在具有多孔结构和空心形貌的泡沫铜上,其表面比纯Ni薄膜粗糙。薄膜主要由金属态Ir组成,含量为(80.0±1.2)at.%。Ir-Ni/CF表现出出色的HER性能,仅需要60 mV的过电位就能获得10 mA·cm^(–2)电流密度,塔菲尔斜率(Tafel)低至40 mV·dec^(–1),交换电流密度j0为0.657 mA·cm^(–2),达到了商用Pt/C催化剂的87.6%。并且在碱性溶液中,长时间的析氢实验显示Ir-Ni/CF具有良好的电催化稳定性。相比于Ir/CF和Ni/CF,Ir-Ni/CF的电催化活性显著提升,这主要归因于两方面的因素:一方面是薄膜相对粗糙的表面增加了活性中心的表面积,另一方面是Ir与Ni在析氢反应中的协同效应。Iridium nickel(Ir-Ni)thin films were prepared on copper foam substrates by electrodeposition technology.The electrocatalytic hydrogen evolution(HER)performance of the films was expected to be improved by depending on the three-dimensional porous structure of foam copper(CF)and the excellent catalytic and corrosion resistance of Ir-Ni thin films.The electrodeposition process was executed under galvanostatic method.The resulting Ir-Ni thin film was subsequently compared with pure Ir and Ni films,which were also electrodeposited on copper foam.The surface morphology and chemical composition of the films were analyzed employing scanning electron microscopy(SEM),energy dispersive spectroscopy(EDS)and X-ray photoelectron spectroscopy(XPS),and the electrocatalytic performance of the films was evaluated via linear sweep voltammetry(LSV).The results showed that the Ir-Ni thin film was successfully adhered to the porous and hollow-structured copper foam, exhibiting a relatively rougher surface compared to the pure Ni film. The film was predominantly composed of metallic Ir, with an atomic content of 80.0±1.2, further demonstrating the success of the deposition process. Remarkably, the Ir-Ni/CF demonstrated superior HER performance, achieving a current density of 10 mA·cm^(–2) with an overpotential of merely 60 mV and a Tafel slope as low as 40 mV·dec^(-1). The exchange current density j0 of Ir-Ni/CF, calculated by the Tafel extrapolation method, was 0.657 mA·cm^(–2), approximately twice that of the Ni film and 87.6% of the commercially available Pt/C catalysts. Furthermore, it exhibited commendable electrocatalytic stability in an alkaline solution, as evidenced by prolonged hydrogen evolution experiments. The electrocatalytic activity of the Ir-Ni/CF was significantly higher than that of Ir/CF and Ni/CF. This improvement can be primarily attributed to two pivotal factors: the increase in active surface area due to the relative roughness of the film, and the cooperative effect of Ir and Ni in the HER process.

关 键 词：铱镍薄膜 电沉积 电催化剂 析氢反应 泡沫铜 

分 类 号：TG176[金属学及工艺—金属表面处理]