VCP镍金线镀镍均匀性改善  

Improvement of uniformity of nickel plating on VCP nickel gold wire

作　　者：周勇胜 康厚宽 崔红兵 Zhou Yongsheng;Kang Houkuan;Cui Hongbing

机构地区：[1]东莞康源电子有限公司,广东东莞523000 [2]东莞市高精密印制线路板工程技术研究中心,广东东莞523000

出　　处：《印制电路资讯》2024年第6期75-78,共4页Printed Circuit Board Information

摘　　要：本文通过研究VCP电镀镍金时不同板边陪镀图形对镀层厚度极差的影响,结合成本及均匀性要求,选择适合的方案应用到批量生产中,改善了镀镍时镀层厚度极差过大的问题。This article studies the influence of different dummy patterns on the plating thickness range during VCP Ni/Au plating.With the requirement of cost and uniformity,select an appropriate program for mass-production,solved the problem of excessive plating thickness range during nickel plating.

关 键 词：均匀性 极差 陪镀图形 

分 类 号：TQ1[化学工程]