铜面平滑处理的微蚀液及其在高频高速PCB中的应用  

Micro-etching solution of smoothing copper surface and its application in high frequency and high speed PCB

作　　者：杜小林 陈润伟 叶绍明 林旭荣 林秀鑫 张剑如 Du Xiaolin;Chen Runwei;Ye Shaoming;Lin Xurong;Lin Xiuxin;Zhang Jianru

机构地区：[1]广东东硕科技有限公司,广东广州511400 [2]汕头超声印制板公司,广东汕头515041

出　　处：《印制电路资讯》2024年第6期79-83,共5页Printed Circuit Board Information

摘　　要：随着人工智能(AI)、机器学习(ML)和云计算技术的快速发展,信号传输速率从10Gbps快速提升112Gbps,甚至在不久的将来达到224Gbps。高速信号(>112 Gbps)因为信号完整性而提出导体表面低轮廓的要求。由于趋肤效应影响,在高速PCB压合前处理制程中,高粗糙度铜面粗化处理已经不能满足高速信号传输损耗需求。本文开发出一种铜面平滑处理的微蚀液,对HVLP铜、RTF铜和中粗化铜面均有极佳的平滑处理效果,HVLP铜箔处理后的Rz<1.2μm,Sdr<2%。相对低粗糙度键合剂,在28GHz频率下插入损耗提升9.6%,可以满足224Gbps信号传输损耗的需求。With the rapid development of artificial intelligence(AI),machine learning(ML)and cloud computing technologies,the signal transmission rate has rapidly increased from 10Gbps to 112Gbps,and even reached to 224Gbps in the near future.High speed signal(>112 Gbps)poses stricter requirements for signal integrity.Due to the skin effect,the high roughness copper surface can't meet the needs of high-speed signal transmission loss.In this paper,a micro-etching solution for smoothing copper surface has been developed,which has excellent smoothing effect on HVLP copper,RTF copper and roughening copper surface.The Rz and Sdr of HVLP copper foil are less than 1.2μm and 2%respectively.Comparing with low roughness adhesion promoter,the insertion loss at 28GHz increases by 9.6%,which can meet the needs of 224Gbps signal transmission loss.

关 键 词：高频高速 平滑处理 微蚀 信号完整性 

分 类 号：TN4[电子电信—微电子学与固体电子学]