印制电路板翘曲改善方法探究  

Research on improving method of plate bending

作　　者：蒋茂胜 江正全 戴科峰 王林 Jiang Maosheng;Jiang Zhengquan;Dai Kefeng;Wang Lin

机构地区：[1]广东依顿电子科技股份有限公司,广东中山528400

出　　处：《印制电路资讯》2024年第6期87-90,共4页Printed Circuit Board Information

摘　　要：为了减少印制电路板的翘曲对印制电路板生产流程的效率和品质的影响,根据印制电路板流程中影响翘曲的三大因素(设计对称性、热涨冷缩、材料特性),对印制电路板流程排查。研究发现设计对称性对翘曲影响最大,成品板厚越薄越明显;在热、湿制程中印制电路板的生产工具及摆放影响翘曲的合格率。根据印制电路板在各生产流程中温度、湿度对印制电路板翘曲的影响规律,在设计上对单元内无铜区、板边和辅助边做相应的互补残铜率和分段处理,可较好地解决印制电路板的翘曲问题。In order to reduce the impact of board warp/bend on the efficiency and quality of printed circuit board production process,three major factors affecting board warp/bend in the printed circuit board production process are investigated according to the design symmetry,thermal expansion and contraction,and material properties.The research found that the design symmetry has the greatest impact on board warp/bend,and the effect becomes more significant as the board thickness decreases.During hot and humid processes,the production tools and arrangement of printed circuit boards affect the pass rate of board warp/bend.According to the impact rules of temperature and humidity on board warp/bend in various production processes of printed circuit boards,complementary redundancy rate and segmented processing are conducted on the non-copper area within the unit,board edge,and auxiliary edge to solve the problem of board warp/bend in the design.

关 键 词：热涨冷缩 热湿制程 非常规结构或非对称性结构 

分 类 号：TN4[电子电信—微电子学与固体电子学]