低压大电流驱动器结构设计及实验研究  

Design and Experimental Study of Main Circuit and Heat Dissipation Structure of Low Voltage and High Current Driver

作　　者：张华 党杰 ZHANG Hua;DANG Jie(Department of Naval Armaments,Lanzhou 730000,Gansu,China)

机构地区：[1]海军装备部,甘肃兰州730000

出　　处：《机械研究与应用》2024年第6期157-160,共4页Mechanical Research & Application

摘　　要：为满足一种航空用低压大电流驱动器(母线电压28 V、母线电流220 A)运行的可靠性,该文对驱动器主回路的母线支撑电容的选型进行优化设计,以尽可能降低主回路的寄生电感,减小对功率器件的电压应力冲击。此外,为确保整个系统长时间运行在额定工况下时,功率器件的结温保持在合理的范围内,对系统的散热装置也进行了重新设计。基于以上两点,对系统的主回路和结构进行了优化设计并对控制器的热属性进行了仿真与实验验证,结果表明:仿真结果能够很好地反映实际损耗,使器件的温升得到了有效控制。In order to meet the reliability of an aviation low voltage and high current driver(bus voltage 28 V,bus current 220 A),this paper optimizes the selection of bus support capacitors in the main circuit of the driver,in order to reduce the parasitic inductance of the main circuit as much as possible and reduce the voltage stress impact on the power device.In addition,in order to ensure that the whole system runs under rated conditions for a long time,the junction temperature of the power device is within a reasonable range,and the cooling device of the system is also redesigned.Based on the above two points,the main loop and structure of the system are optimized in this paper,and the thermal properties of the controller are simulated and verified by experiments.The results show that the simulation results can well reflect the actual loss,and the device temperature rise is effectively controlled.

关 键 词：主回路 低压大电流 模块化设计 

分 类 号：TM351[电气工程—电机] TM341