利用SEM分析微型密封电磁继电器旋铆开裂产生机理  

The Analysis of the Cracking Mechanism of Miniature Sealed Electromagnetic Relay by SEM

作　　者：宿云辉 石磊 尹毅 杨秀富 SU Yun-hui;SHI Lei;YIN Yi;YANG Xiu-fu

机构地区：[1]贵州振华群英电器有限公司,贵州贵阳550018

出　　处：《机电元件》2024年第6期30-33,共4页Electromechanical Components

摘　　要：本文通过使用SEM及能谱的方法,对微型密封电磁继电器在使用旋铆工艺过程中产生开裂现象进行分析,阐述影响旋铆开裂的主要因素与基体材料表面碳含量关系较大,并基于产品工艺出发,针对旋铆开裂的控制要点给出了意见,对使用相似工艺存在的问题解决具备一定的参考意义。By using SEM and energy spectrum,this paper analyzes the cracking phenomenon of miniature sealed relays in the process of using the orbital riveting technology,explains that the main factors affecting orbital riveting cracking are closely related to the surface carbon content,and gives opinions on the control points of orbital riveting cracking during the product process,which has certain reference significance for solving the problems existing in similar processes.

关 键 词：微型密封电磁继电器 旋铆工艺 开裂现象 热处理 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]