低玻璃化转变温度的玻璃粉对异质结主栅浆料性能的影响  

Effect of Glass Powder with Low Glass Transition Temperature on the Properties of Heterojunction Main Gate Slurry

作　　者：万莉莎 王海清 王静 WAN Lisha;WANG Haiqing;WANG Jing(Sichuan Dongshu New Material Co.,Ltd.,Deyang 611800,China)

机构地区：[1]四川东树新材料有限公司,四川德阳611800

出　　处：《电工材料》2024年第6期15-19,共5页Electrical Engineering Materials

摘　　要：以低玻璃化转变温度的玻璃粉为研究对象,研究异质结主栅浆料在玻璃粉不同的Bi_(2)O_(3)-PbO-TeO_(2)质量比、添加量、电池片固化温度对电性能和290℃焊接附着力的影响。使用差示扫描量热仪和超景深显微镜分别测试玻璃化转变温度和观察电池片形貌,测试方式有TLM电性能测试和焊接附着力测试。结果表明,当Bi_(2)O_(3)-PbO-TeO_(2)的质量比为0∶15∶15,玻璃粉的质量分数为1%,固化温度为200℃时,主栅浆料电性能最优,290℃焊接附着力为3.63 N。Taking glass powder with low glass transition temperature as the research object,the effect of electrical properties and welding adhesion to 290℃on the heterojunction main grid slurry about different quality ratio of Bi_(2)O_(3)-PbO-TeO_(2),amount of glass powder,and curing temperature were studied.The characterization methods used included differential scanning calorimeter and ultra-depth microscope,and the test methods included TLM electrical property test and welding adhesion test.The results show that when mass ratio of Bi_(2)O_(3)-PbO-TeO_(2) was 0∶15∶15,mass ratio of glass powder was 1%,and curing temperature was 200℃,the electrical properties of the main gate slurry were the best,and the welding adhesion at 290℃was 3.63 N.

关 键 词：低玻璃化转变温度 玻璃粉 异质结主栅 焊接附着力 

分 类 号：TM914[电气工程—电力电子与电力传动]