挠性大载流高屏蔽电路板制作技术研究  

Research on manufacturing technology of FPCB with high current carrying and shielding capacity

在线阅读下载全文

作  者:王文剑 WANG Wenjian(Shenzhen Threetek Technology Co.,Ltd.,Shenzhen 518000,Guangdong,China;Guangdong High Current Carrying and Shielding Capacity FPCB Engineering Technology Research Center,Shenzhen 518000,Guangdong,China)

机构地区:[1]深圳市实锐泰科技有限公司,广东深圳518000 [2]广东省柔性大载流高屏蔽电路板工程技术研究中心,广东深圳518000

出  处:《印制电路信息》2024年第12期27-32,共6页Printed Circuit Information

摘  要:挠性大载流高屏蔽电路板已被应用于智能网联汽车或低空飞行器领域。为提升该类电路板性能,研究一款铜厚由245μm过渡至105μm的阶梯型厚铜且具备屏蔽功能的挠性电路板,创新地形成“线路图形蚀刻一半铜厚→压覆覆盖膜→线路图形蚀刻另一半铜厚”的厚铜大载流镂空线路制作技术,“制作正面阶梯线路→制作105μm线路→制作245μm线路”的阶梯型厚铜大载流线路制作技术,棕化后贴覆盖膜这一覆盖膜压覆填充厚铜线路制作技术,以及“处理等离子→单独制作银浆层→压覆2层覆盖膜”的银浆屏蔽层制作技术。采用上述技术制作的产品具有较高可靠性。High current carrying and high shielding capacity FPCB has been applied in the field of intelligent connected vehicles or low altitude aircraft.In order to achieve the goal of improving the performance of this type of circuit board,this article analyzes and studies a flexible circuit board with shielding properties and a stepped thick copper that transitions from 245μm copper thickness to 105μm copper thickness.The following technologies are formed:the thick copper high current carrying hollow circuit manufacturing technology of"etching half of the copper thickness in the circuit pattern→covering the film→etching the other half of the copper thickness in the circuit pattern",the production technology of stepped thick copper high current carrying circuit,which first produces proof stepped circuits,then produces 105μm circuits,and finally produces 245μm circuits,the production technology of thick copper circuit by laminating and filling the covering film after browning and applying the covering film,and the production technology of silver paste shielding layer of plasma treatment first,then separately producing a silver paste layer,and finally laminating two layers of overlay film.Products made using the above technologies have high reliability.

关 键 词:挠性电路板 大载流 厚铜 高屏蔽 

分 类 号:TN41[电子电信—微电子学与固体电子学]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象