低轨卫星微波毫米波印制电路板技术开发  

Development of microwave and millimeter-wave PCB for LEO satellite

作　　者：袁欢欣 林旭荣 张学东 YUAN Huanxin;LIN Xurong;ZHANG Xuedong(China Circuit Technology(Shantou)Corporation,Shantou 515065,Guangdong,China;China circuit Technology(Second Plant)Corporation,Shantou 515065,Guangdong,China;China Circuit Technology(Third Plant)Corporation,Shantou 515065,Guangdong,China)

机构地区：[1]汕头超声印制板公司,广东汕头515065 [2]汕头超声印制板(二厂)有限公司,广东汕头515065 [3]汕头超声印制板(三厂)有限公司,广东汕头515065

出　　处：《印制电路信息》2024年第12期38-47,共10页Printed Circuit Information

摘　　要：卫星通信向微波毫米波频段演进已成为发展趋势,与此同时也面临着更大的挑战。从互联网的概念入手,介绍了目前国内外低轨卫星技术发展及其应用进展,梳理了低轨天上端与低轨地面端2类印制电路板(PCB)产品,阐述了用于降低PCB重量的低密度发泡材料聚甲基丙烯酰亚胺(PMI)混压加工技术、相关高频高速材料选型加工及其非对称结构的板翘控制技术、毫米波封装天线与阵列天线技术等关键技术。The evolution of satellite communication systems to the microwave and millimeter wave frequency band has become a development trend,and at the same time,it also faces greater challenges.Starting from the concept of the Internet,the development and application progress of LEO satellites is introduced.Then,two typical types of products of LEO sky transmitter(Tx)printed circuit board(PCB)and LEO ground receiving(Rx)PCB are sorted out.Finally,some key process technologies of LEO PCB are outlined,namely,low density foaming material poly methacrylimide(PMI)mixed pressing technology for reducing PCB weight,selection and processing of hybrid structure by high frequency and high speed base-materials and warpage control technology,millimeter wave antenna-in-package(AiP)and array antenna technology.

关 键 词：低轨卫星 印制电路板 毫米波通信 阵列天线 封装天线 

分 类 号：TN41[电子电信—微电子学与固体电子学]