氢化膜对钛表面电镀镀层结合的影响  

Effect of hydrogenation films on the bonding ofelectroplating coatings on titanium surface

作　　者：宗豪 刘新宽[1] 刘实 ZONG Hao;LIU Xinkuan;LIU Shi(School of Materials and Chemistry,University of Shanghai for Science and Technology,Shanghai 200093,China;Shanghai Wansheng Alloy Materials Co.,Ltd.,Shanghai 201901,China)

机构地区：[1]上海理工大学材料与化学学院,上海200093 [2]上海万生合金材料有限公司,上海201901

出　　处：《有色金属材料与工程》2024年第6期86-93,共8页Nonferrous Metal Materials and Engineering

基　　金：国家自然科学基金资助项目(51771119)。

摘　　要：通过扫描电子显微镜(scanning electron microscope,SEM)、X射线衍射仪(X-ray diffractometer,XRD)、能谱仪(energy dispersive spectrometer,EDS)研究了氢化膜对钛表面电镀镀层结合的影响。试验结果表明:钛经过HCl和H_(2)SO_(4)混合溶液的氢化处理,一方面可以实现钛基体上电镀镍铜,提高镀层结合强度,镀层结合强度最大值为9.6 MPa;但另一方面氢化形成蜂窝状多孔的氢化膜会限制镀层结合强度。多孔氢化膜会导致电镀产生中空多孔的镀层,也会使氢化产生的杂质残留在孔内无法排出;再者,多孔氢化膜的强度不高,这些因素都会影响镀层和基体的结合,在一定程度上限制了镀层结合强度的提高。The effect of hydrogenated film on the bonding of titanium surface electroplating layer was investigated by scanning electron microscope(SEM),X-ray diffractometer(XRD)and energy dispersive spectrometer(EDS).The experimental results show that titanium hydrogenated with a mixture of hydrochloric acid and sulfuric acid,on the one hand,can realize nickel-copper plating on titanium substrate,which improves the bonding strength of the plating layer,and the maximum bonding strength of the plating layer is 9.6 MPa;however,on the other hand,the formation of honeycomb-like porous hydrogenated film can limit the bonding strength of the plating layer.The porous hydrogenated film not only causes a hollow and porous plating layer,but also stops the removal of the impurities generated by hydrogenation from the holes,furthermore,the porous hydrogenated film is not strong,and all these factors affect the bonding between the plating layer and the substrate,which limits the improvement of the bonding strength of the plating layer to some extent.

关 键 词：钛 电镀 氢化膜 镀层结合强度 中空镀层 

分 类 号：TQ153.1[化学工程—电化学工业]