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作 者:王佳 高影 林彦萍 梁霄 李艳 李毅 任勃 杨晓东[1,2] WANG Jia;GAO Ying;LIN Yanping;LIANG Xiao;LI Yan;LI Yi;REN Bo;YANG Xiaodong(Institute for Interdisciplinary Biomass Functional Materials Studies,Jilin Engineering Normal University,Changchun Jilin 130052,China;Jilin Provincial Key Laboratory of Straw-Based Functional Materials,Jilin Engineering Normal University,Changchun Jilin 130052,China;School of Mechanical and Vehicle Engineering,Jilin Engineering Normal University,Changchun Jilin 130052,China)
机构地区:[1]吉林工程技术师范学院生物质功能材料交叉学科研究院,吉林长春130052 [2]吉林工程技术师范学院吉林省秸秆基功能材料重点实验室,吉林长春130052 [3]吉林工程技术师范学院机械与车辆工程学院,吉林长春130052
出 处:《北方建筑》2024年第6期17-21,共5页Northern Architecture
基 金:吉林省科技发展计划项目(YDZJ202201ZYTS317);吉林省教育厅科学技术研究规划项目(JJKH20230223KJ)。
摘 要:本研究采用纯物理方法,将玉米秸秆进行粉碎和筛分预处理后,在20℃~150℃的温度范围内施加10 MPa~90 MPa的压力,并在保温保压的条件下持续2 h,成功制备出成型的无胶玉米秸秆板材。板材的密度范围为0.67 g/cm^(3)~1.29 g/cm^(3),已达到高密度板的标准。使用万能力学试验机对无胶玉米秸秆板材进行力学性能表征,得到板材的抗弯强度范围为0.20 MPa~30.1 MPa,拉伸强度范围为0.21 MPa~21.7 MPa。这表明施加压力可以缩短玉米秸秆纤维之间的距离,并促使木质素与其他纤维间形成氢键网格,同时调控纤维素增加氢键网格的强度;而温度则有助于半纤维素固化生成更多热固性树脂进而增强无胶玉米秸秆板材的内部粘合。We employed a purely physical method in this research to prepare adhesive-free corn stalk boards by crushing and sieving the corn stalks as a pretreatment,followed by high-temperature and high-pressure molding under conditions of temperature ranging from 20℃ to 150℃,pressure ranging from 10 MPa to 90 MPa,and a dwell time of 2 hours.The density of the boards ranged from 0.67 g/cm^(3) to 1.29 g/cm^(3),meeting the standards for high-density boards.Mechanical properties characterization was conducted using a universal testing machine,revealing that the bending strength of the adhesive-free corn stalk boards ranged from 0.20 MPa to 30.1 MPa,while the tensile strength ranged from 0.21 MPa to 21.7 MPa.This indicates that applying pressure can shorten the distance between corn stalk fiber and promote the formation of hydrogen bond grid between lignin and other fibers,while regulating cellulose to increase the strength of hydrogen bond grid,and meanwhile,temperature helps solidify hemicellulose to generate more thermosetting resin,thereby enhancing the internal bonding of adhesive-free corn stalk board.
分 类 号:TU506[建筑科学—建筑技术科学]
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